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IMPACT-T1 – Materials for Scaled Reconfigurable and mm-Wave Interconnects
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Patent Filings
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Integrated Circuit With Topological Semimetal Interconnect (Patent...
- Integrated Circuit With Topological Semimetal Interconnect Application Type: Utility Country: United States Status: Filed on 20-Jul-2022, Published by Patent Office Organization: ...
URL: https://www.src.org/library/patent/p2088/
Modified: 2022-07-20 - 25KB
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