Integrated Circuit With Topological Semimetal Interconnect

    • Application Type:
      Utility
      Country:
      United States
      Status:
      Filed on 20-Jul-2022, Published by Patent Office
      Organization:
      Yale University
      SRC Filing ID:
      P2088

    Inventors

    • Judy J. Cha (Yale)
    • Hyeuk Jin Han (Yale)

    Related Patents

    P1982
    Application Expired
    nCORE

    Integrated Circuit With Topological Semimetal Interconnect

    Judy J. Cha (Yale); Hyeuk Jin Han (Yale)
    Patent Application Expired
    Application Type: Provisional

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