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DARPA’s ERI Developing Breakthrough US National Electronics Capabilities
DARPA-led ERI investments, SRC JUMP, MTO, and its corporate partners have organized to build up a fundamental research base in the fields underlying future microelectronics technologies.
TECHCON 2021 Call for Abstracts – Now Open
The Call for Abstracts is now open. Deadline for submission is 3:00 p.m. Eastern Time on Wednesday March 31, 2021
SRC Newsletter: January Issue
Find out which SRC researchers have been recognized for their work
SRC Funded Research Featured at ISSCC
SRC member companies and supported research are an integral part of the IEEE International Solid ...
Carbon Nanotube Advances Announced by TSMC
Advances built off Professor Kummel’s research funded by SRC
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Most extraordinary research
We help you grow technical and market leadership through academic research
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Flexible international program in design and process areas
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new programs
We are creating the future
Breaking ground with compelling new initiatives
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year program
Jan 2018 - Dec 2022
Jan 2018 - Dec 2022
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