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Scalable two-dimensional materials advance future-gen electronics

This work resulted in large area, atomically thin WSe2 films, greatly improved by a number of metrics

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TECHCON 2018 Call for Abstracts - Now Open

The deadline for TECHCON 2018 abstract submissions is 3:00 p.m. ET, April 12, 2018.

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SRC/NSF launch efforts in artificial intelligence and human-computing interface

NSF partners with SRC to launch ICA: Intelligent Cognitive Assistants research program to advance...

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SONIC Researchers Reinvent the Inductor after Two Centuries

A third smaller than conventional devices, they might be used in ultra-compact wireless communica...

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JUMP Announces New Centers

The recently launched JUMP research program announces new research centers

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