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DARPA’s ERI Developing Breakthrough US National Electronics Capabilities

DARPA-led ERI investments, SRC JUMP, MTO, and its corporate partners have organized to build up a fundamental research base in the fields underlying future microelectronics technologies.

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TECHCON 2021 Call for Abstracts – Now Open

The Call for Abstracts is now open. Deadline for submission is 3:00 p.m. Eastern Time on Wednesday March 31, 2021

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SRC Newsletter: January Issue

Find out which SRC researchers have been recognized for their work

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SRC Funded Research Featured at ISSCC

SRC member companies and supported research are an integral part of the IEEE International Solid ...

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Carbon Nanotube Advances Announced by TSMC

Advances built off Professor Kummel’s research funded by SRC

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