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NEWLIMITS-T2 – 2D Materials Devices and Interconnect Technologies
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2 similar documents, best matches first. |
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- 1:
Multiferroic Heterostructures (Patent P1872) - SRC
- Multiferroic Heterostructures Application Type: Utility Patent Number: 11276728 Country: United States Status: Filed on 7-Feb-2020, Issued on 15-Mar-2022 Organization: University ...
URL: https://www.src.org/library/patent/p1872/
Modified: 2022-03-15 - 22KB
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- 2:
Converting Ta- and Ti-Based Cu Diffusion Barriers into their...
- Converting Ta- and Ti-Based Cu Diffusion Barriers into their sp2 Bond Based 2D Materials to Enhance Diffusion Barrier Properties with Atomically-thin Thickness Application Type: ...
URL: https://www.src.org/library/patent/p1824/
Modified: 2022-03-29 - 22KB
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