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Thrust/Theme
Packaging & Interconnect Systems
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4 similar documents, best matches first. |
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- 1:
Buried Solder Bumps for AC-Coupled Microelectronic Intercconnects...
- Buried Solder Bumps for AC-Coupled Microelectronic Intercconnects Application Type: Divisional Patent Number: 6927490 Country: United States Status: Filed on 7-Oct-2004, Issued on ...
URL: https://www.src.org/library/patent/p0513/
Modified: 2005-08-09 - 24KB
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- 2:
Inductively Coupled Electrical Connectors (Patent P0237) - SRC
- Inductively Coupled Electrical Connectors Application Type: Utility Patent Number: 6885090 Country: United States Status: Filed on 28-Nov-2001, Issued on 26-Apr-2005 Organization: ...
URL: https://www.src.org/library/patent/p0237/
Modified: 2005-04-26 - 24KB
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- 3:
Orientation-Independant Thermosyphon Heat Spreader (Patent P0464...
- Orientation-Independant Thermosyphon Heat Spreader Application Type: European Patent Office Patent Number: 1379825 Status: Filed on 6-Nov-2003, Issued on 7-Feb-2007, Patent ...
URL: https://www.src.org/library/patent/p0464/
Modified: 2007-02-07 - 24KB
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- 4:
Orientation-Independent Thermosyphon Heat Spreader (Patent P0196...
- Orientation-Independent Thermosyphon Heat Spreader Application Type: Utility Patent Number: 7556086 Country: United States Status: Filed on 6-Apr-2001, Issued on 7-Jul-2009, Patent ...
URL: https://www.src.org/library/patent/p0196/
Modified: 2009-07-07 - 24KB
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