Buried Solder Bumps for AC-Coupled Microelectronic Intercconnects

    • Application Type:
      Divisional
      Patent Number:
      6927490
      Country:
      United States
      Status:
      Filed on 7-Oct-2004, Issued on 9-Aug-2005, Patent Abandoned
      Organization:
      North Carolina State University
      SRC Filing ID:
      P0513

    Inventors

    • Paul D. Franzon (NC State)
    • Stephen E. Mick (NC State)
    • John M. Wilson (NC State)

    Related Patents

    P0237
    Issued
    GRC

    Inductively Coupled Electrical Connectors

    Paul D. Franzon (NC State); Stephen E. Mick (NC State); John M. Wilson (NC State)
    Patent Issued (on 26-Apr-2005)
    Application Type: Utility
    P0584
    Abandoned Application
    GRC

    Microelectronic Packages Including Solder bumps and AC-Coupled Interconnect Elements

    Paul D. Franzon (NC State); Stephen E. Mick (NC State); John M. Wilson (NC State)
    Patent Application Abandoned
    Application Type: Divisional

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