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NEWLIMITS

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NEWLIMITS-T2 – 2D Materials Devi... 2
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1 through 5 of 5 similar documents, best matches first.   
1: Multiferroic Heterostructures (Patent P1872) - SRC
Multiferroic Heterostructures Application Type: Utility Patent Number: 11276728 Country: United States Status: Filed on 7-Feb-2020, Issued on 15-Mar-2022 Organization: University ...
URL: https://www.src.org/library/patent/p1872/
Modified: 2022-03-15 - 22KB
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2: Cross-Coupled Gated Tunnel Diode (XTD) Device with Increased...
Cross-Coupled Gated Tunnel Diode (XTD) Device with Increased Peak-to-Valley Current Ratio (PVCR) Application Type: Utility Country: United States Status: Filed on 9-Mar-2022, ...
URL: https://www.src.org/library/patent/p2024/
Modified: 2022-03-09 - 23KB
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3: Advanced Precursors for Selective Atomic Layer Deposition using...
Advanced Precursors for Selective Atomic Layer Deposition using Self-Assembled Monolayers Application Type: Utility Country: United States Status: Filed on 1-Nov-2021, Published by ...
URL: https://www.src.org/library/patent/p1974/
Modified: 2021-11-01 - 24KB
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4: Valley Spin Hall Effect Based Non-Volatile Memory (Patent P1912...
Valley Spin Hall Effect Based Non-Volatile Memory Application Type: Utility Patent Number: 11250896 Country: United States Status: Filed on 24-Dec-2020, Issued on 15-Feb-2022 ...
URL: https://www.src.org/library/patent/p1912/
Modified: 2022-02-15 - 25KB
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5: Converting Ta- and Ti-Based Cu Diffusion Barriers into their...
Converting Ta- and Ti-Based Cu Diffusion Barriers into their sp2 Bond Based 2D Materials to Enhance Diffusion Barrier Properties with Atomically-thin Thickness Application Type: ...
URL: https://www.src.org/library/patent/p1824/
Modified: 2022-03-29 - 22KB
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