Questions?
[x] Content Type
Patent Filings

[x] GRC Science Area
INT – Interconnect Sciences

SRC Program
GRC 7

Thrust/Theme
Back End Processes 3
Materials 2
Processes – Processes 1
Reliability 1

1 through 7 of 7 similar documents, best matches first.   
1: Fluorine Diffusion Barriers for Fuorinated Dielectrics in Integrated...
Fluorine Diffusion Barriers for Fuorinated Dielectrics in Integrated Circuits Application Type: Utility Patent Number: 6818990 Country: United States Status: Filed on 3-Apr-2000, ...
URL: https://www.src.org/library/patent/p0589/
Modified: 2004-11-16 - 22KB
Find Similar Documents
2: Passivated Copper Conductive Layers for Microelectric Applications...
Passivated Copper Conductive Layers for Microelectric Applications Application Type: Divisional Patent Number: 6057223 Country: United States Status: Filed on 10-Feb-1998, Issued ...
URL: https://www.src.org/library/patent/p0048/
Modified: 2000-05-02 - 22KB
Find Similar Documents
3: Oxidation Resistant High Conductivity Copper Layers For Microelectroni...
Oxidation Resistant High Conductivity Copper Layers For Microelectronic Applications and Process of Making Same Application Type: Divisional Patent Number: 5959358 Country: United ...
URL: https://www.src.org/library/patent/p0054/
Modified: 1999-09-28 - 24KB
Find Similar Documents
4: Passivated Copper Conductive Layers for Microelectronic Applications...
Passivated Copper Conductive Layers for Microelectronic Applications and Methods of Manufacturing Same Application Type: Utility Patent Number: 5766379 Country: United States ...
URL: https://www.src.org/library/patent/p0015/
Modified: 1998-06-16 - 24KB
Find Similar Documents
5: Electrical Device Including Dielectric Layer Formed By Direct...
Electrical Device Including Dielectric Layer Formed By Direct Patterning Process Application Type: Divisional Patent Number: 6946736 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0327/
Modified: 2005-09-20 - 22KB
Find Similar Documents
6: Oxidation Resistant High Conductivity Copper Layers for Microelectric...
Oxidation Resistant High Conductivity Copper Layers for Microelectric Applications and Process of Making Same Application Type: Utility Patent Number: 5622608 Country: United ...
URL: https://www.src.org/library/patent/p0007/
Modified: 1997-04-22 - 22KB
Find Similar Documents
7: Systems, Methods and Computer Program Products for Prediction...
Systems, Methods and Computer Program Products for Prediction of Defect-Related Failures in Integrated Circuits Application Type: Utility Patent Number: 5822218 Country: United ...
URL: https://www.src.org/library/patent/p0050/
Modified: 1998-10-13 - 22KB
Find Similar Documents
1 through 7 of 7 similar documents, best matches first.