Questions?
[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

Content Type
Events 45
Other 1

SRC Program
SRC 30
GRC 16
3D EC 4
FCRP 4

Year
2015 1
2013 4
2012 5
2011 20
2010 15

Center
C2S2 19
FENA 19
GSRC 19
IFC 19
MSD 19
MuSyC 11
TxACE 7
EBSM 6
C-FAR 5
CNFD 5
FAME 5
INDEX 5
LEAST 5
NPT 5
SONIC 5
SWAN 5
TerraSwarm 5
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
AMS-CSD – Analog/Mixed-Signal Ci... 2
CADT – Computer-Aided Design and... 2
CD – Circuit Design 2
HWS – Hardware Security 2
ISD – Integrated System Design 2
LPD – Logic & Physical Design 2
SLD – System Level Design 2
TT – Test & Testability 2
VER – Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

31 through 46 of 46 similar documents, best matches first.   
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31: TECHCON 2013 Authors Kit: Submitting the Oral Presentation -...
TECHCON 2012 TECHCON 2013 Author's Kit: Submitting the Oral Presentation The deadline for presentation materials is August 21, 2013 Please follow these instructions carefully; our ...
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32: TECHCON 2012 - Author's Kit: Submitting Oral Presentation - SRC
TECHCON 2012: Instructions for Submitting Oral Presentation Materials Presentation Materials: DEADLINE IS August 22, 2012 Please follow these instructions carefully; our time and ...
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33: Submitting Presentation - TECHCON 2011 AUthor's Kit - SRC
TECHCON 2011 Author's Kit Instructions for Submitting Oral Presentation Materials Presentation Materials: DEADLINE IS August 24, 2011 Please follow these instructions carefully; ...
URL: https://www.src.org/calendar/e004113/submit-presentation/
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34: 2013 GRC SACC and TAB Chair Recognition - SRC
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35: TECHCON 2010: Guidelines for 4-Page Paper and Electronic Submission...
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36: pdfSRC/NSF Design Forum - Posiltion Statement
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37: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals ...
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38: pdfSRC: GRC Design Forum Postion Statement - Jeff Parkhurst,Intel
Future Design Environment Complexity in 2017: - Designs will contain over 200B transistors. - Design teams will remain constant size o CAD must bridge the productivity GAP - ...
URL: https://www.src.org/...2764/parkhurst-position-statement.pdf
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39: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
TECHCON 2012: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable from all ...
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40: Posters: Undergraduate Research Opportunities (URO) - SRC
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41: pdfE003932 - Variability Forum - Torres
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42: TECHCON 2010: URO Author's Kit - Poster Instructions - SRC
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43: pdfSRC/NSF Design Forum - Position Statement
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44: Preparing Your Oral Presentation - TECHCON 2011 Author's Kit...
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45: pdfE003932 - Variability Forum - Spanos
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46: pdfPowerPoint Presentation
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31 through 46 of 46 similar documents, best matches first.   
<< previous Page: 1 2 Results by:Thunderstone