Questions?
[x] GRC Science Area
CADTS – Computer Aided Design & Test Sciences

Content Type
Events 32
Other 1

SRC Program
GRC 19
SRC 14
3D EC 4
FCRP 4

Year
2015 2
2013 2
2012 2
2011 18
2010 8

Center
C2S2 6
FENA 6
GSRC 6
IFC 6
MSD 6
TxACE 5
MuSyC 4
C-FAR 3
CNFD 3
EBSM 3
FAME 3
INDEX 3
LEAST 3
SONIC 3
SWAN 3
TerraSwarm 3
NPT 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
AMS-CSD – Analog/Mixed-Signal Ci... 3
CADT – Computer-Aided Design and... 3
CD – Circuit Design 3
HWS – Hardware Security 3
ISD – Integrated System Design 3
LPD – Logic & Physical Design 3
SLD – System Level Design 3
TT – Test & Testability 3
VER – Verification 3
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

31 through 33 of 33 similar documents, best matches first.   
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31: pdfSRC/NSF Design Forum - Professor Arvind
Future Directions in Design Automation Arvind, CSAIL , MIT Will there be a greater or smaller variety of electronic chips a decade from now? There is a dramatic decrease in the ...
URL: https://www.src.org/...64/prof-arvind-position-statement.pdf
Modified: 2011-08-02 - 9KB
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32: pdfE003932 - Variability Forum - Cao
Predictive Variability Predictive Variability Modeling Modeling Predictive Variability Predictive Variability Modeling Modeling d D i I li ti d D i I li ti and Design Implications ...
URL: https://www.src.org/calendar/e003932/e003932_s2_3_cao.pdf
Modified: 2010-06-29 - 2.6MB
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33: pdfPowerPoint Presentation
RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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