Questions?
Content Type
Patent Filings 347
Other 195
Events 159

SRC Program
GRC 185
SRC 179
STARnet 105
NRI 101
FCRP 76
nCORE 25
JUMP 24
JUMP2 13
SRCEA 2
3D EC 1
ICA 1
MSR-Intel 1

Year
2024 9
2023 17
2022 15
2021 18
2020 11
2019 11
2018 17
2017 30
2016 13
2015 9
2014 11
2013 15
2012 29
2011 49
2010 93
2009 1
2008 1

Center
C-SPIN 43
FENA 27
SWAN 27
LEAST 24
C2S2 21
GSRC 20
C-FAR 19
NRI-NSF 18
FAME 17
MSD 15
INDEX 14
CNFD 13
IFC 12
MIND 12
WIN 12
ASCENT 11
SONIC 11
E2CDA-NRI 10
TxACE 8
AMML 7
CRISP 7
Benchmarking 6
IMPACT 6
NEWLIMITS 6
ComSenTer 5
TerraSwarm 5
CHIRP 4
DEEP3M 4
EBSM 4
MuSyC 4
CBRIC 3
NRI-Projects 3
ACE 2
ADA 2
CAPSL 2
CUBIC 2
E2CDA 2
NCRC 2
SMART 2
SUPREME 2

Thrust/Theme
PAT – Patterning 16
CD – Circuit Design 14
TT – Test & Testability 9
Advanced Devices & Technologies 8
LPD – Logic & Physical Design 8
NMP – Nanomanufacturing Material... 8
AMML-T1 – Antiferromagnetic Magn... 7
AMS-CSD – Analog/Mixed-Signal Ci... 6
ASCENT-T1 – Vertical CMOS 6
DCMOS – Digital CMOS Technologie... 6
Factory Systems 6
ISD – Integrated System Design 6
NEM – Nanoengineered Materials 6
CRISP-T1 – Hardware Support for ... 5
IMPACT-T1 – Materials for Scaled... 5
PKG – Packaging 5
TechCAD – Technology CAD 5
AIHW – Artificial Intelligence H... 4
CADT – Computer-Aided Design and... 4
DEEP3M-T4 – Architectures 4
HWS – Hardware Security 4
LMD – Logic and Memory Devices 4
VER – Verification 4
ASCENT-T3 – Heterogeneous Integr... 3
ESH – Environment Safety and Hea... 3
NEWLIMITS-T2 – 2D Materials Devi... 3
Pat(MPS) – Patterning 3
ADA-T1 – Deft Development 2
ADS – Alternative Device Structu... 2
ASCENT-T2 – Beyond CMOS 2
CAPSL-T4 – Architectures and Sys... 2
CRISP-T3 – Scaling Applications ... 2
ComSenTer-T1 – Systems and Algor... 2
DEEP3M-T2 – Circuits 2
DV – Design Verification 2
DesSyn – Design Synthesis 2
E2CDA2 – E2CDA 2.0 2
IMPACT-T2 – Materials for Storag... 2
Modeling & Simulation 2
NEWLIMITS-T1 – Novel Computing a... 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T4 – Characterization ... 2
Physical Design 2
SLD – System Level Design 2
SMART-T1 – Spin-orbit Torque Mat... 2
Synthesis & Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T1 – ARENA Integrator 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
Contamination Control 1
Cost Reduction 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T3 – Materials 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
Interconnect Architecture 1
Lithography 1
Logic Design 1

GRC Science Area
CADTS – Computer Aided Design & ... 35
NMS – Nanomanufacturing Sciences 34
ICSS – Integrated Circuit & Syst... 25
MPS – Material & Process Science... 23
DES – Design Sciences 20
LIT – Lithography Sciences 15
NIS – Nanostructure & Integratio... 14
DS – Device Sciences 11
IPS – Interconnect & Packaging S... 8
MBP – Materials & Bulk Processes... 8
PID – Process Integration & Devi... 7
CSR – Cross-disciplinary Semicon... 6
SRCEA – SRC Education Alliance 6
MIC – Microstructure Sciences 5
PKG – Packaging Sciences 4
ES-H – Environmental Safety & He... 2
INT – Interconnect Sciences 2
MFGPS – Manufacturing Process Sc... 2
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
MFG – Manufacturing Sciences 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>