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- 1:
 2016 - Packaging Research Needs Document
- Microelectronic Packaging Needs 01/27/2016 Contributors: Ravi Mahajan (Intel Corporation), Luke England (GLOBALFOUNDRIES), Luu Nguyen (Texas Instruments), Matthew Varughese ...
URL: https://www.src.org/.../pkg/research-needs/2016/2016-pkg.pdf
Modified: 2016-02-09 - 110KB
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- 2:
Innovative and Intelligent Internet of Things (I3T) Research...
- Innovative & Intelligent Internet of Things Research Needs: Innovative and Intelligent Internet of Things July 2016 The Semiconductor Research Corporation (SRC) Global Research ...
URL: https://www.src.org/.../i3t/research-needs/2016/2016-i3t.pdf
Modified: 2016-07-05 - 48KB
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- 3:
AMS-CSD Needs Document - FINAL - June 20, 2016
- Analog/Mixed-Signal Circuits, Systems and Devices + TxACE Research Needs: AMS-CSD + TxACE June 2016 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) ...
URL: https://www.src.org/.../research-needs/2016/2016-ams-csd.pdf
Modified: 2016-06-02 - 80KB
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- 4:
Microsoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
- cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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- 5:
3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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