Questions?
[x] GRC Science Area
IPS – Interconnect & Packaging Sciences

Content Type
Events 7
Other 1

SRC Program
SRC 5
GRC 3
3D EC 1
FCRP 1

Year
2016 1
2013 3
2012 1
2011 2

Center
C-FAR 3
CNFD 3
FAME 3
INDEX 3
LEAST 3
SONIC 3
SWAN 3
TerraSwarm 3
C2S2 2
EBSM 2
FENA 2
GSRC 2
IFC 2
MSD 2
MuSyC 2
TxACE 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1
NPT 1

Thrust/Theme
PKG – Packaging 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 8 of 8 similar documents, best matches first.   
1: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
Find Similar Documents
2: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
© 2013 International Business Machines Corporation SRC TECHCON 2013 Putting Watson to Work September 9, 2013 Richard Talbot Director, PLM IBM Power Systems - Austin, Texas ...
URL: https://www.src.org/...004683/watson/talbot-techcon-2013.pdf
Modified: 2013-09-19 - 3.0MB
Find Similar Documents
3: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
Find Similar Documents
4: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals ...
URL: https://www.src.org/calendar/e004683/preparing-presentation/
Modified: 2013-04-24 - 24KB
Find Similar Documents
5: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
TECHCON 2012: Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable from all ...
URL: https://www.src.org/...4/authors-kit/preparing-presentation/
Modified: 2012-05-10 - 24KB
Find Similar Documents
6: TECHCON 2013 Authors Kit: Poster Instructions - SRC
TECHCON 2012 TECHCON 2013 Author's Kit: Poster Instructions All paper presenters are expected to present a poster. Failure to present a poster will adversely affect the judging of ...
URL: https://www.src.org/calendar/e004683/poster-instructions/
Modified: 2013-04-24 - 24KB
Find Similar Documents
7: Preparing Your Oral Presentation - TECHCON 2011 Author's Kit...
TECHCON 2011 Author's Kit Preparing The Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they expect visuals that are readable ...
URL: https://www.src.org/calendar/e004113/preparing-presentation/
Modified: 2011-04-15 - 24KB
Find Similar Documents
8: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
Find Similar Documents
1 through 8 of 8 similar documents, best matches first.