[x]
GRC Science Area
IPS – Interconnect & Packaging Sciences
[x]
Thrust/Theme
Back End Processes
|
1 through 3 of
3 similar documents, best matches first. |
|
- 1:
Semiconductor Research Corporation - SRC
- GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB Find Similar Documents
- 2:
Multiple Copper Vias for Intergrated Circuit Metallization (Patent...
- Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB Find Similar Documents
- 3:
Multiple Copper Vias for Integrated Circuit Metallization and...
- Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB Find Similar Documents
|
|