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CM – Compact Modeling

Content Type

SRC Program

Year

Center

GRC Science Area

DS – Device Sciences	3
CADTS – Computer Aided Design & ...	2
ICSS – Integrated Circuit & Syst...	2
IPS – Interconnect & Packaging S...	2
NMS – Nanomanufacturing Sciences	2
CSR – Cross-disciplinary Semicon...	1
DES – Design Sciences	1
ES-H – Environmental Safety & He...	1
FAC – Factory Sciences	1
GEN – General	1
INT – Interconnect Sciences	1
ISA – Industrial Support Activit...	1
LIT – Lithography Sciences	1
MBP – Materials & Bulk Processes...	1
MFG – Manufacturing Sciences	1
MFGPS – Manufacturing Process Sc...	1
MIC – Microstructure Sciences	1
MPS – Material & Process Science...	1
MSS – Manufacturing Systems Scie...	1
NIS – Nanostructure & Integratio...	1
PID – Process Integration & Devi...	1
PKG – Packaging Sciences	1
SMS – Semiconductor Modeling & S...	1
SRCEA – SRC Education Alliance	1
TT – Technology Transfer	1

1 through 3 of 3 similar documents, best matches first.

1: Semiconductor Research Corporation - SRC: GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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2: TI_NA_Dallas_map_front: Kilby East 6 3 5 7 5 N. Lobby 7 5 6 3 5 7 5 A p p r o x . 7 m i l e s A p p r o x . 6 m i l e s 1 1 4 1 2 1 D A L L A S I N T E R N A T I O N A L A I R P O R T DALLAS LOVE FIELD T ...
URL: https://www.src.org/calendar/e005983/ti_dallas_map.pdf
Modified: 2016-11-09 - 225KB
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3: Methods and Apparatuses for Integrated Packaging of Microelectromechan...: Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices Application Type: Utility Patent Number: 8557623 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1230/
Modified: 2013-10-15 - 26KB
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