Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices

    • Application Type:
      Utility
      Patent Number:
      8557623
      Country:
      United States
      Status:
      Filed on 17-Jun-2010, Issued on 15-Oct-2013, Patent Abandoned
      Organization:
      University of Texas at Arlington
      SRC Filing ID:
      P1230

    Inventors

    • Donald P. Butler (UT/Arlington)
    • Zeynep Celik-Butler (UT/Arlington)
    • Mohammad S. Rahman (UT/Arlington)
    • Murali M. Chitteboyina (UT/Arlington)

    Related Patents

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    Application Expired
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    Donald P. Butler (UT/Arlington); Zeynep Celik-Butler (UT/Arlington); Murali M. Chitteboyina (UT/Arlington); Mohammad S. Rahman (UT/Arlington)
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    P1424
    Abandoned Application
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    Methods and Apparatuses for Integrated Packaging of Microelectromechanical Devices

    Donald P. Butler (UT/Arlington); Zeynep Celik-Butler (UT/Arlington); Murali M. Chitteboyina (UT/Arlington); Mohammad S. Rahman (UT/Arlington)
    Patent Application Abandoned
    Application Type: Divisional

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