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IFC

Content Type
Events 8
Patent Filings 5
Other 1

SRC Program
FCRP 7
SRC 7

Year
2012 3
2011 1
2010 4

GRC Science Area
CADTS – Computer Aided Design & ... 7
CSR – Cross-disciplinary Semicon... 7
DS – Device Sciences 7
NMS – Nanomanufacturing Sciences 7
ICSS – Integrated Circuit & Syst... 3
IPS – Interconnect & Packaging S... 3

1 through 14 of 14 similar documents, best matches first.   
1: 2010 SACC and TAB Chair Recognition - SRC
2010 SACC and TAB Chair Recognition Steve Hillenius (l), SRC GRC Executive Director, presented the 2010 SACC and TAB Chair Awards to 19 industry representatives including Darvin ...
URL: https://www.src.org/calendar/e003428/tab-chair-awards/
Modified: 2010-09-28 - 22KB
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2: Semiconductor Research Corporation - SRC
FCRP FCRP Focus Center Research Program (Legacy) Multi-Scale Systems Research Center Creation of a comprehensive and a systematic solution to the distributed multi-scale system ...
URL: https://www.src.org/program/fcrp/
Modified: 2023-10-10 - 32KB
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3: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB
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4: TechFair at TECHCON 2010 - SRC
TechFair at TECHCON 2010 Over the two days of TECHCON 2010, TechFair will provide the forum for networking and synergy between industry and university researchers, and between ...
URL: https://www.src.org/calendar/e003428/techfair/
Modified: 2010-08-04 - 21KB
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5: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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6: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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7: TECHCON 2010 Evaluation Summary - SRC
TECHCON 2010 Evaluation Summary Overall, 134 TECHCON attendees returned evaluations; breakdown by question is: The papers/posters presented indicate research of value to the ...
URL: https://www.src.org/calendar/e003428/evaluation/
Modified: 2010-09-30 - 26KB
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8: TECHCON 2010 Preview - SRC
TECHCON 2010 Preview TECHCON is the primary event where SRC presents the best of research sponsored by the membership and showcases the students who perform the research. It is ...
URL: https://www.src.org/calendar/e003428/preview/
Modified: 2010-07-28 - 24KB
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9: Hybrid Resistor/FET-Logic Demultiplexer Architecture Design for...
Hybrid Resistor/FET-Logic Demultiplexer Architecture Design for Hybrid CMOS/Nanodevice Circuits Application Type: Utility Patent Number: 7737726 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1119/
Modified: 2010-06-15 - 22KB
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10: Thermal Management Devices, Systems, and Methods (Patent P1044...
Thermal Management Devices, Systems, and Methods Application Type: Utility Patent Number: 7532467 Country: United States Status: Filed on 4-Oct-2007, Issued on 12-May-2009, Patent ...
URL: https://www.src.org/library/patent/p1044/
Modified: 2009-05-12 - 22KB
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11: 3-D ICs Equipped with Double Sided Power, Coolant, and Date Features...
3-D ICs Equipped with Double Sided Power, Coolant, and Date Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1143/
Modified: 2013-10-01 - 23KB
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12: 3-D ICs Equipped with Double Sided Power, Coolant, and Data Features...
3-D ICs Equipped with Double Sided Power, Coolant, and Data Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1419/
Modified: 2014-10-01 - 23KB
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13: Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB
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14: pdfMicrosoft Word - final-fcrp-3d-2012.docx
Semicondu Cross-Cent 3D Inte 2nd E-Wo March 9, Organizer 1. Introdu 12:00 - 12 2. Cooling 12:15 - 12 12:40 - 1: 1:00 - 1:0 3. Archite 1:05 - 1:2 1:25 - 1:4 1:45 - 2:0 2:05 - 2:1 4. ...
URL: https://www.src.org/calendar/e004681/agenda.pdf
Modified: 2012-03-26 - 102KB
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1 through 14 of 14 similar documents, best matches first.