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1 through 14 of
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- 1:
2010 SACC and TAB Chair Recognition - SRC
- 2010 SACC and TAB Chair Recognition Steve Hillenius (l), SRC GRC Executive Director, presented the 2010 SACC and TAB Chair Awards to 19 industry representatives including Darvin ...
URL: https://www.src.org/calendar/e003428/tab-chair-awards/
Modified: 2010-09-28 - 22KB Find Similar Documents
- 2:
Semiconductor Research Corporation - SRC
- FCRP FCRP Focus Center Research Program (Legacy) Multi-Scale Systems Research Center Creation of a comprehensive and a systematic solution to the distributed multi-scale system ...
URL: https://www.src.org/program/fcrp/
Modified: 2023-10-10 - 32KB Find Similar Documents
- 3:
Description
- Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
URL: https://www.src.org/calendar/e004114/call-for-abstracts.pdf
Modified: 2012-01-26 - 27KB Find Similar Documents
- 4:
TechFair at TECHCON 2010 - SRC
- TechFair at TECHCON 2010 Over the two days of TECHCON 2010, TechFair will provide the forum for networking and synergy between industry and university researchers, and between ...
URL: https://www.src.org/calendar/e003428/techfair/
Modified: 2010-08-04 - 21KB Find Similar Documents
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TECHCON 2012 (Event E004114) - SRC
- TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB Find Similar Documents
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TECHCON 2011 (Event E004113) - SRC
- TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB Find Similar Documents
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TECHCON 2010 Evaluation Summary - SRC
- TECHCON 2010 Evaluation Summary Overall, 134 TECHCON attendees returned evaluations; breakdown by question is: The papers/posters presented indicate research of value to the ...
URL: https://www.src.org/calendar/e003428/evaluation/
Modified: 2010-09-30 - 26KB Find Similar Documents
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TECHCON 2010 Preview - SRC
- TECHCON 2010 Preview TECHCON is the primary event where SRC presents the best of research sponsored by the membership and showcases the students who perform the research. It is ...
URL: https://www.src.org/calendar/e003428/preview/
Modified: 2010-07-28 - 24KB Find Similar Documents
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Hybrid Resistor/FET-Logic Demultiplexer Architecture Design for...
- Hybrid Resistor/FET-Logic Demultiplexer Architecture Design for Hybrid CMOS/Nanodevice Circuits Application Type: Utility Patent Number: 7737726 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1119/
Modified: 2010-06-15 - 22KB Find Similar Documents
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Thermal Management Devices, Systems, and Methods (Patent P1044...
- Thermal Management Devices, Systems, and Methods Application Type: Utility Patent Number: 7532467 Country: United States Status: Filed on 4-Oct-2007, Issued on 12-May-2009, Patent ...
URL: https://www.src.org/library/patent/p1044/
Modified: 2009-05-12 - 22KB Find Similar Documents
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3-D ICs Equipped with Double Sided Power, Coolant, and Date Features...
- 3-D ICs Equipped with Double Sided Power, Coolant, and Date Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1143/
Modified: 2013-10-01 - 23KB Find Similar Documents
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3-D ICs Equipped with Double Sided Power, Coolant, and Data Features...
- 3-D ICs Equipped with Double Sided Power, Coolant, and Data Features Application Type: Continuation (in part) Patent Number: 8546930 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1419/
Modified: 2014-10-01 - 23KB Find Similar Documents
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Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
- Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB Find Similar Documents
- 14:
Microsoft Word - final-fcrp-3d-2012.docx
- Semicondu Cross-Cent 3D Inte 2nd E-Wo March 9, Organizer 1. Introdu 12:00 - 12 2. Cooling 12:15 - 12 12:40 - 1: 1:00 - 1:0 3. Archite 1:05 - 1:2 1:25 - 1:4 1:45 - 2:0 2:05 - 2:1 4. ...
URL: https://www.src.org/calendar/e004681/agenda.pdf
Modified: 2012-03-26 - 102KB Find Similar Documents
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14 similar documents, best matches first. |
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