Questions?
[x] Year
2016

Content Type
Events 2
Other 2

SRC Program
GRC 4

Thrust/Theme
PKG – Packaging 2

GRC Science Area
IPS – Interconnect & Packaging S... 2
PKG – Packaging Sciences 2

1 through 4 of 4 similar documents, best matches first.   
1: pdf2016 SLD Research Needs Document
System Level Design Research Needs: System Level Design April 2016 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) program member companies are ...
URL: https://www.src.org/.../sld/research-needs/2016/2016-sld.pdf
Modified: 2016-04-08 - 121KB
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2: pdfAMS-CSD Needs Document - FINAL - June 20, 2016
Analog/Mixed-Signal Circuits, Systems and Devices + TxACE Research Needs: AMS-CSD + TxACE June 2016 The Semiconductor Research Corporation (SRC) Global Research Collaboration (GRC) ...
URL: https://www.src.org/.../research-needs/2016/2016-ams-csd.pdf
Modified: 2016-06-02 - 80KB
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3: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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4: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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