Search: infield%3Aenc%3AdnavConType%3DPublications

Back End Processes

Content Type

Patent Filings	7
Other	1

SRC Program

Center

GRC Science Area

MPS – Material & Process Science...	8
INT – Interconnect Sciences	4
IPS – Interconnect & Packaging S...	3
CADTS – Computer Aided Design & ...	1
CSR – Cross-disciplinary Semicon...	1
DES – Design Sciences	1
DS – Device Sciences	1
ES-H – Environmental Safety & He...	1
FAC – Factory Sciences	1
GEN – General	1
ICSS – Integrated Circuit & Syst...	1
ISA – Industrial Support Activit...	1
LIT – Lithography Sciences	1
MBP – Materials & Bulk Processes...	1
MFG – Manufacturing Sciences	1
MFGPS – Manufacturing Process Sc...	1
MIC – Microstructure Sciences	1
MSS – Manufacturing Systems Scie...	1
NIS – Nanostructure & Integratio...	1
NMS – Nanomanufacturing Sciences	1
PID – Process Integration & Devi...	1
PKG – Packaging Sciences	1
SMS – Semiconductor Modeling & S...	1
SRCEA – SRC Education Alliance	1
TT – Technology Transfer	1

1 through 8 of 8 similar documents, best matches first.

1: Semiconductor Research Corporation - SRC: GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
Find Similar Documents

2: Oxidation Resistant High Conductivity Copper Layers For Microelectroni...: Oxidation Resistant High Conductivity Copper Layers For Microelectronic Applications and Process of Making Same Application Type: Divisional Patent Number: 5959358 Country: United ...
URL: https://www.src.org/library/patent/p0054/
Modified: 1999-09-28 - 24KB
Find Similar Documents

3: Passivated Copper Conductive Layers for Microelectronic Applications...: Passivated Copper Conductive Layers for Microelectronic Applications and Methods of Manufacturing Same Application Type: Utility Patent Number: 5766379 Country: United States ...
URL: https://www.src.org/library/patent/p0015/
Modified: 1998-06-16 - 24KB
Find Similar Documents

4: Films for Use in Microelectronic Devices and Methods of Producing...: Films for Use in Microelectronic Devices and Methods of Producing Same Application Type: Utility Patent Number: 6306495 Country: United States Status: Filed on 27-Jul-2000, Issued ...
URL: https://www.src.org/library/patent/p0156/
Modified: 2001-10-23 - 22KB
Find Similar Documents

5: Films for Use in Microelectronic Devices and Methods of Producing...: Films for Use in Microelectronic Devices and Methods of Producing Same Application Type: Utility Patent Number: 6114032 Country: United States Status: Filed on 10-Apr-1998, Issued ...
URL: https://www.src.org/library/patent/p0155/
Modified: 2000-09-05 - 22KB
Find Similar Documents

6: Passivated Copper Conductive Layers for Microelectric Applications...: Passivated Copper Conductive Layers for Microelectric Applications Application Type: Divisional Patent Number: 6057223 Country: United States Status: Filed on 10-Feb-1998, Issued ...
URL: https://www.src.org/library/patent/p0048/
Modified: 2000-05-02 - 22KB
Find Similar Documents

7: Multiple Copper Vias for Intergrated Circuit Metallization (Patent...: Multiple Copper Vias for Intergrated Circuit Metallization Application Type: Continuation Patent Number: 7078817 Country: United States Status: Filed on 13-Dec-2004, Issued on ...
URL: https://www.src.org/library/patent/p0521/
Modified: 2006-07-18 - 22KB
Find Similar Documents

8: Multiple Copper Vias for Integrated Circuit Metallization and...: Multiple Copper Vias for Integrated Circuit Metallization and Methods of Fabricating Same Application Type: Utility Patent Number: 6919639 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0268/
Modified: 2005-07-19 - 22KB
Find Similar Documents

1 through 8 of 8 similar documents, best matches first.