Questions?
[x] SRC Program
3D EC

Content Type
Events 4

Year
2011 4

GRC Science Area
CADTS – Computer Aided Design & ... 4
ICSS – Integrated Circuit & Syst... 4
IPS – Interconnect & Packaging S... 4

1 through 4 of 4 similar documents, best matches first.   
1: pdfPowerPoint Presentation
RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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2: pdf3D IMAPS
Tezzaron Semiconductor 05/05/2011 SRC 3D Summit Bob Patti, CTO rpatti@tezzaron.com 1 Tezzaron Semiconductor 05/05/2011 Why We Scale? 2 >180nm 90nm 65nm 130nm 45nm 28nm 22nm 16nm ...
URL: https://www.src.org/calendar/e004357/04-patti.pdf
Modified: 2011-05-04 - 4.4MB
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3: pdfPresentation Title
PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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4: pdfState-of-the-3D Industry Future Opportunities and Challenges
Rev 2.0 1  Building the Case for 3D  3D Vs. Scaling  Technology Roadmap  Technology Hurdles  Psycho-political Hurdles  Evolutionary vs. Revolutionary  The ...
URL: https://www.src.org/calendar/e004357/01-vontrapp.pdf
Modified: 2011-05-04 - 2.3MB
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