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SRC Program

SRC	326
GRC	253
FCRP	39
JUMP2	27
NRI	22
JUMP	10
STARnet	7
SRP	6
3D EC	3
Auto	3
ERI	2
ICA	1
nCORE	1

Year

2024	18
2023	38
2022	49
2021	36
2020	17
2019	19
2018	22
2017	38
2016	21
2015	20
2014	18
2013	25
2012	44
2011	168
2010	113
2009	1
2008	1

Thrust/Theme

PKG – Packaging	9
ESH – Environment Safety and Hea...	8
HWS – Hardware Security	7
AMS-CSD – Analog/Mixed-Signal Ci...	6
CADT – Computer-Aided Design and...	5
ISD – Integrated System Design	5
LMD – Logic and Memory Devices	5
NMP – Nanomanufacturing Material...	5
SLD – System Level Design	5
ASCENT-T1 – Vertical CMOS	4
I3T – Innovative and Intelligent...	4
LPD – Logic & Physical Design	4
CD – Circuit Design	3
TT – Test & Testability	3
VER – Verification	3
AIHW – Artificial Intelligence H...	2
ComSenTer-T1 – Systems and Algor...	2
Modeling & Simulation	2
NEM – Nanoengineered Materials	2
PAT – Patterning	2
SCARF – Supply Chain AI Realized...	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADS – Alternative Device Structu...	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T2 – Beyond CMOS	1
ASCENT-T3 – Heterogeneous Integr...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CBRIC-T1 – Neuro-inspired Algori...	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
DesTech – Design Techniques	1
Doping Technologies	1
EP3C – Efficiency and Performanc...	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FACSYS – Factory Systems	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IRP – India Research Program	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1
PatSys – Patterning Systems	1