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[x] SRC Program
GRC

Content Type
Other 140
Events 135
Patent Filings 22

Year
2024 1
2023 9
2022 14
2021 8
2020 8
2019 8
2018 21
2017 7
2016 9
2015 15
2014 4
2013 5
2012 5
2011 127
2010 32
2009 1

Center
TxACE 10
EBSM 8
CHIRP 7
ACE4S 2
CAIST 1
CDADIC 1
CEMPI 1
IPC 1
NCRC 1

Thrust/Theme
ESH – Environment Safety and Hea... 10
PKG – Packaging 10
HWS – Hardware Security 8
TT – Test & Testability 8
VER – Verification 7
AMS-CSD – Analog/Mixed-Signal Ci... 6
CADT – Computer-Aided Design and... 6
ISD – Integrated System Design 6
LPD – Logic & Physical Design 6
SLD – System Level Design 5
CD – Circuit Design 4
DesTech – Design Techniques 4
I3T – Innovative and Intelligent... 3
NMP – Nanomanufacturing Material... 3
Physical Design 3
DV – Design Verification 2
LMD – Logic and Memory Devices 2
Modeling & Simulation 2
Reliability 2
Synthesis & Verification 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Resist 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
TCAD-MBPS 1
TM – Thermal Management 1
TechCAD – Technology CAD 1

GRC Science Area
CADTS – Computer Aided Design & ... 43
ICSS – Integrated Circuit & Syst... 29
NMS – Nanomanufacturing Sciences 12
IPS – Interconnect & Packaging S... 10
DES – Design Sciences 6
PKG – Packaging Sciences 5
ES-H – Environmental Safety & He... 4
INT – Interconnect Sciences 2
MFGPS – Manufacturing Process Sc... 2
MIC – Microstructure Sciences 2
NIS – Nanostructure & Integratio... 2
PID – Process Integration & Devi... 2
CSR – Cross-disciplinary Semicon... 1
DS – Device Sciences 1
FAC – Factory Sciences 1
GEN – General 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

211 through 240 of 297 similar documents, best matches first.   
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211: pdfResearch Needs Document: Logic and Memory Devices
Research Needs Document: Logic and Memory Devices June 2019 Semiconductor Research Corp. (SRC) Research Triangle Park, NC 27703 Background This document is prepared to accompany ...
URL: https://www.src.org/.../lmd/research-needs/2019/2019-lmd.pdf
Modified: 2019-07-01 - 50KB
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212: Computer-Aided Design and Test Poster Session - May 14th - SRC
Computer-Aided Design and Test Annual Review Poster Session May 14th Posters Presentation 1 Yanzhao Wang, Portland State Equivalence Checking for HLS Accelerators Design ...
URL: https://www.src.org/calendar/e007211/cadt/posters/day2/
Modified: 2021-05-20 - 25KB
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213: pdf2011 Circuits Needs Document
Integrated Circuit and Systems Sciences Research Needs: Circuit Design December 2011 The SRC GRC member companies are pleased to release this document that describes the research ...
URL: https://www.src.org/...icss/research-needs/2011/circuits.pdf
Modified: 2011-12-07 - 34KB
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214: pdfSRC/NSF Design Forum - Position Statement
NSF/SRC Forum on Future Directions for Design Automation Research Top Three Challenges for Electronic Design Automation Sachin Sapatnekar, University of Minnesota As system ...
URL: https://www.src.org/...hin-sapatnekar-position-statement.pdf
Modified: 2011-08-02 - 15KB
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215: Method and System for Synthesizing Relative Timing Constraints...
Method and System for Synthesizing Relative Timing Constraints on an Integrated Circuit Design to Facilitate Timing Verification Application Type: Continuation Patent Number: ...
URL: https://www.src.org/library/patent/p1354/
Modified: 2012-11-27 - 24KB
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216: Method and System for Synthesizing Relative Timing Constraints...
Method and System for Synthesizing Relative Timing Constraints on an Integrated Circuit Design to Facilitate Timing Verification Application Type: Utility Patent Number: 8239796 ...
URL: https://www.src.org/library/patent/p1202/
Modified: 2012-08-07 - 24KB
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217: Biography for Jason Cong - UCLA - SRC
JASON CONG received his B.S. degree in computer science from Peking University in 1985, his M.S. and Ph. D. degrees in computer science from the University of Illinois at ...
URL: https://www.src.org/calendar/e003506/cong-bio/
Modified: 2011-06-17 - 21KB
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218: pdf2009 Summer Study: Architecture and Appliction Perspectives for...
Architecture and Application Perspectives for Application Perspectives for 3D Integration Yuan Xie Associate Professor Associate Professor The Pennsylvania State University ...
URL: https://www.src.org/...2009s-study-siii-architecture-xie.pdf
Modified: 2011-06-17 - 940KB
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219: pdfExplainable Design Automation with Machine Learning Manish Pandey
Explainable Design Automation with Machine Learning Manish Pandey Synopsys Machine learning techniques are increasingly being applied to solve many optimization and classification ...
URL: https://www.src.org/calendar/e006556/abstract_pandey.pdf
Modified: 2018-07-20 - 35KB
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220: pdfEnabling Verification of Analog and Mixed-Signal Circuits using...
Enabling Verification of Analog and Mixed-Signal Circuits using Machine Learning Peng Li Texas A&M University While analog and mixed-signal (AMS) designs grow in complexity and ...
URL: https://www.src.org/calendar/e006556/abstract_li.pdf
Modified: 2018-06-28 - 11KB
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221: Quantifier Elimination by Dependency Sequents (Patent P1309)...
Quantifier Elimination by Dependency Sequents Application Type: Utility Patent Number: 8438513 Country: United States Status: Filed on 30-Dec-2011, Issued on 7-May-2013, Patent ...
URL: https://www.src.org/library/patent/p1309/
Modified: 2013-05-07 - 22KB
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222: Signal Tracing Using On-Chip Memory For In-System Post-Fabrication...
Signal Tracing Using On-Chip Memory For In-System Post-Fabrication Debug Application Type: Utility Patent Number: 9720036 Country: United States Status: Filed on 18-Aug-2014, ...
URL: https://www.src.org/library/patent/p1495/
Modified: 2017-08-01 - 23KB
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223: Signal Tracing using ON-Chip Memory for In-System Post-Fabrication...
Signal Tracing using ON-Chip Memory for In-System Post-Fabrication Debug Application Type: Continuation Patent Number: 10732221 Country: United States Status: Filed on 26-Jun-2017, ...
URL: https://www.src.org/library/patent/p1733/
Modified: 2020-08-04 - 24KB
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224: Non-Invasive Pre-Bond TSV Test using Ring Oscillators and Multiple...
Non-Invasive Pre-Bond TSV Test using Ring Oscillators and Multiple Voltage Levels Application Type: Continuation Patent Number: 10444279 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1635/
Modified: 2019-10-15 - 23KB
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225: Biography for Riko Radojcic - Qualcomm - SRC
RIKO RADOJCIC is a leader of various Design-for-Technology initiatives at Qualcomm CDMA Technologies, addressing design for 3D integration, manufacturability, and variability ...
URL: https://www.src.org/calendar/e003506/radojcic-bio/
Modified: 2011-06-17 - 20KB
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226: Biography for Jan Rabaey - Univ. of California/Berkeley - SRC
JAN RABAEY received the EE and Ph.D degrees in applied sciences from the Katholieke Universiteit Leuven, Belgium, respectively in 1978 and 1983. From 1983 till 1985, he was ...
URL: https://www.src.org/calendar/e003506/rabaey-bio/
Modified: 2011-06-17 - 21KB
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227: Architecture and Application Perspectives for 3D Integration...
Architecture and Application Perspectives for 3D Integration Professor Yuan Xie - Pennsylvania State University 3D Integration emerges as an attractive option to sustain Moore's ...
URL: https://www.src.org/calendar/e003506/xie-abs/
Modified: 2011-06-17 - 20KB
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228: Non-Invasive Pre-Bond TSV TestUsing Ring Oscillators and Multiple...
Non-Invasive Pre-Bond TSV TestUsing Ring Oscillators and Multiple Voltage Levels Application Type: Utility Patent Number: 9478720 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1392/
Modified: 2016-11-01 - 24KB
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229: pdfA Path Toward AI - The System View For Applying Machine Learning
A Path Toward AI - The System View For Applying Machine Learning Li-C Wang University of California/Santa Barbara Applying machine learning, especially in design and test, has ...
URL: https://www.src.org/calendar/e006556/abstract_wang.pdf
Modified: 2018-07-10 - 32KB
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230: Application and Network Optimized next-Generation System Research...
Application and Network Optimized next-Generation System Research at IBM Dr. Shahrokh Daijavad, IBM We will describe a new systems-level trend toward the utilization of massive ...
URL: https://www.src.org/calendar/e003506/daijavad-abs/
Modified: 2011-06-17 - 20KB
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231: Engineering Research Center for Environmentally Benign Semiconductor...
Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Review Date: Wednesday, March 26, 2014, 7:30 a.m. - Thursday, March 27, 2014, 8 p.m. MT Location: ...
URL: https://www.src.org/calendar/e005160/
Modified: 2014-09-27 - 66KB
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232: Engineering Research Center for Environmentally Benign Semiconductor...
Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Review Date: Wednesday, March 20, 2013, 7 a.m. - Thursday, March 21, 2013, 2 p.m. MT Location: ...
URL: https://www.src.org/calendar/e004929/
Modified: 2013-09-21 - 61KB
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233: Formal Verification of a Logic Design Through Implicit Enumeration...
Formal Verification of a Logic Design Through Implicit Enumeration of Strongly Connected Components Application Type: Utility Patent Number: 6526551 Country: United States Status: ...
URL: https://www.src.org/library/patent/p0189/
Modified: 2003-02-25 - 22KB
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234: pdf2004 Circuits Needs Document.doc
1 ICSS Research Needs: Circuit Design Addressing the Grand Challenges listed in the 2003 International Technology Roadmap for Semiconductors (http://public.itrs.net) requires the ...
URL: https://www.src.org/...icss/research-needs/2004/circuits.pdf
Modified: 2011-02-03 - 12KB
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235: pdf2006 SRC ICSS Research Needs Document for Circuit Design
ICSS Research Needs: Circuit Design Addressing the Grand Challenges listed in the 2005 International Technology Roadmap for Semiconductors (http://public.itrs.net) requires circuit ...
URL: https://www.src.org/...icss/research-needs/2006/circuits.pdf
Modified: 2011-02-03 - 45KB
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236: V-TML Workshop - Bio - Peng Li - SRC
Biography: Peng Li Prof. Peng Li Peng Li received the Ph. D. degree in electrical and computer engineering from Carnegie Mellon University in 2003. He is presently Professor of ...
URL: https://www.src.org/calendar/e006556/li-bio/
Modified: 2018-07-03 - 21KB
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237: pdfSRC GRC: Nano-Morphic Forum - Cavin
Extreme Microsystems: Atomic Level Limits Ralph Cavin and Victor Zhirnov Semiconductor Research Corporation SRC Forum on Nanomorphic Systems Stanford University, November 8&9, 2007 ...
URL: https://www.src.org/calendar/e003062/cavin.pdf
Modified: 2011-08-02 - 595KB
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238: pdfE003676 - Memory Forum - Government-University-Industry Collaborative...
page 1 IME Confidential & Proprietary Government-University-Industry Collaborative Models Singapore Perspective Prof Dim-Lee Kwong Institute of Microelectronics page 2 IME ...
URL: https://www.src.org/calendar/e003676/kwong.pdf
Modified: 2010-07-29 - 646KB
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239: V-TML Workshop - Bio - Pradiptya Ghosh - SRC
Biography: Pradiptya Ghosh Pradiptya Ghosh Pradiptya Ghosh is Sr. Director of Engineering responsible for Calibre Semi-manufacturing Products and has been with Mentor since 2007. ...
URL: https://www.src.org/calendar/e006556/ghosh-bio/
Modified: 2018-07-03 - 20KB
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240: 2015 Summer Study - Bio - Ralph Cavin - SRC
Biography: Ralph Cavin Ralph Cavin A native of Natchez, Mississippi, Ralph K. Cavin received his BSEE (1961) and MSEE (1962) from Mississippi State University and his Ph.D. in ...
URL: https://www.src.org/calendar/e005502/cavin-bio/
Modified: 2015-06-05 - 21KB
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211 through 240 of 297 similar documents, best matches first.   
<< previous Page: 4 5 6 7 8 9 10 next >>