Questions?
[x] Thrust/Theme
PKG – Packaging

Content Type
Events 7
Patent Filings 7
Other 1

SRC Program
GRC 15

Year
2023 1
2022 3
2021 1
2016 2

Center
CHIRP 7
TxACE 3
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
EBSM 1
IPC 1
NCRC 1

GRC Science Area
IPS – Interconnect & Packaging S... 8
PKG – Packaging Sciences 4
NIS – Nanostructure & Integratio... 3
CADTS – Computer Aided Design & ... 1
CSR – Cross-disciplinary Semicon... 1
DES – Design Sciences 1
DS – Device Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
ICSS – Integrated Circuit & Syst... 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NMS – Nanomanufacturing Sciences 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
SRCEA – SRC Education Alliance 1
TT – Technology Transfer 1

1 through 15 of 15 similar documents, best matches first.   
1: pdfPresentation title here
Low environmental impact packaging Presentation to SRC Packaging TAB - 7-14-22 Tim Yeakley 1 Agenda . Change example . Global thinking about products . Government supply chain ...
URL: https://www.src.org/...ow-environmental-impact-packaging.pdf
Modified: 2022-07-22 - 481KB
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2: Electronic Device Carrier Structures Including Polymer Layers...
Electronic Device Carrier Structures Including Polymer Layers as Barriers to Solid State Solder Diffusion and Methods of Forming the Same Application Type: Utility Country: United ...
URL: https://www.src.org/library/patent/p1994/
Modified: 2022-05-21 - 23KB
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3: pdfOverview of Research
Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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4: pdf3DASSM
Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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5: pdfResearch Program Annual Review
Packaging (PKG) Research Program Annual Review July 12-14, 2022 Dallas, TX @ Texas Instruments John Oakley, Science Director Tameka Bell, Research Program Coordinator SRC Select ...
URL: https://www.src.org/...oslides/2022reviewpkgintroduction.pdf
Modified: 2022-07-27 - 514KB
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6: Semiconductor Research Corporation - SRC
GRC GRC Global Research Collaboration Our motivation is to fund the most relevant and critical research for international companies, so we go where the best university talent ...
URL: https://www.src.org/program/grc/
Modified: 2023-10-10 - 33KB
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7: Electrospray Printer (Patent P2030) - SRC
Electrospray Printer Application Type: Utility Country: United States Status: Filed on 1-Nov-2022, Published by Patent Office Organization: Binghamton University - SUNY SRC Filing ...
URL: https://www.src.org/library/patent/p2030/
Modified: 2022-11-01 - 23KB
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8: pdfIRP Advisory Board Meeting
Packaging Research Program e-Kickoff March 22-23, 2023, virtual John Oakley, Science Director LaDonya Dooley, Research Program Coordinator Day 1 : https://www.src.org/calendar/...
URL: https://www.src.org/.../1_2023-ekickoff-pkg-introduction.pdf
Modified: 2023-03-27 - 535KB
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9: Composite Thermal Interface Material Including Aligned Nanofibers...
Composite Thermal Interface Material Including Aligned Nanofibers with Low Melting Temperature Binder Application Type: Utility Patent Number: 8389119 Country: United States ...
URL: https://www.src.org/library/patent/p1023/
Modified: 2013-03-05 - 25KB
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10: pdfVirtual John Oakley, Science Director Tameka Bell & Mary Nichols...
Packaging (PKG) e-Kickoff March 23 and 29-31, 2022 Virtual John Oakley, Science Director Tameka Bell & Mary Nichols, Research Program Coordinator SRC Select Disclosure Because the ...
URL: https://www.src.org/calendar/e007527/pkgintroslides.pdf
Modified: 2022-04-04 - 663KB
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11: Methods, Systems, and Computer Program Products for Asymmetric...
Methods, Systems, and Computer Program Products for Asymmetric Multimode Interconnect Application Type: Utility Patent Number: 9008215 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p1331/
Modified: 2015-04-14 - 22KB
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12: Composite Thermal Interface Material Including Particles and...
Composite Thermal Interface Material Including Particles and Nanofibers Application Type: Utility Patent Number: 7504453 Country: United States Status: Filed on 17-Dec-2004, Issued ...
URL: https://www.src.org/library/patent/p0506/
Modified: 2009-03-17 - 22KB
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13: Methods, Systems, and Computer Program Products for Low Power...
Methods, Systems, and Computer Program Products for Low Power Multimode Interconnect for Lossy and Tightly Coupled Multi-Channel Application Type: Utility Patent Number: 8903010 ...
URL: https://www.src.org/library/patent/p1328/
Modified: 2014-12-02 - 22KB
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14: Systems, Methods, and Computer Readable Media for Fractional...
Systems, Methods, and Computer Readable Media for Fractional Pre-emphasis of Multi-Mode Interconnect Application Type: Utility Patent Number: 8208578 Country: United States Status: ...
URL: https://www.src.org/library/patent/p1191/
Modified: 2012-06-26 - 22KB
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15: pdf2021 Packaging CHIRP Center Review
2021 Packaging CHIRP Center Review August 24-26 - Virtual Event https://www.src.org/calendar/e007230/ Student Poster Information (Abstracts) Featuring: Sanoop Thekkut Ronit Das ...
URL: https://www.src.org/...ster/catalog/chirp_poster_catalog.pdf
Modified: 2021-08-23 - 597KB
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1 through 15 of 15 similar documents, best matches first.