Questions?
[x] GRC Science Area
NMS – Nanomanufacturing Sciences

Content Type
Events 15
Other 1

SRC Program
GRC 8
SRC 8

Year
2016 1
2013 3
2012 4
2011 3
2010 4

Center
EBSM 6
C2S2 5
FENA 5
GSRC 5
IFC 5
MSD 5
MuSyC 4
C-FAR 3
CNFD 3
FAME 3
INDEX 3
LEAST 3
SONIC 3
SWAN 3
TerraSwarm 3
TxACE 3
NPT 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
ESH – Environment Safety and Hea... 4
NEM – Nanoengineered Materials 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 16 of 16 similar documents, best matches first.   
1: Putting Watson to Work (TECHCON 2013) - SRC
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URL: https://www.src.org/calendar/e004683/watson/
Modified: 2013-09-09 - 21KB
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2: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
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3: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
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4: Semiconductor Research Corporation - SRC
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5: TECHCON 2013 Authors Kit: Preparing the Oral Presentation - SRC
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6: TECHCON 2012 - Author's Kit: Preparing Oral Presentation - SRC
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8: NMS Nanoengineered Materials Annual Review (Event E004780) -...
NMS Nanoengineered Materials Annual Review Date: Tuesday, June 12, 2012 - Wednesday, June 13, 2012 Location: Dean's Suite 290, College of Business, 1307 West Highland St., ...
URL: https://www.src.org/calendar/e004780/
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TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
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10: The Challenges and Opportunities of Atomic Layer Etching (Event...
The Challenges and Opportunities of Atomic Layer Etching Date: Thursday, May 5, 2016, 2 p.m.-3 p.m. ET Location: University of Arizona, Tucson, AZ, United States Type: e-Workshop ...
URL: https://www.src.org/calendar/e005904/
Modified: 2016-11-05 - 34KB
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12: TECHCON 2010: Preparing the Oral Presentation - SRC
TECHCON 2010: Technology and Talent for the 21st Century Preparing the Oral Presentation Your audience is accustomed to presentations that rely on visual aids. Consequently, they ...
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14: pdfスライド 1
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15: pdfSlide 1
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16: pdfSlide 1
230 250 270 290 310 0 0 0 0 0 0 0 0 1 2 240 260 280 300 V G (mV) V G (mV) I (nA) V SD = - 30 mV The absence of steps the sequential nature coupling of the atom. Figure 4b shows ...
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1 through 16 of 16 similar documents, best matches first.