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SRC Program

SRC	630
GRC	375
FCRP	134
NRI	52
JUMP2	25
JUMP	11
STARnet	7
SRP	6
3D EC	5
Auto	3
SRCEA	3
nCORE	3
ICA	2
ERI	1
Undergrad	1

Year

2024	22
2023	51
2022	62
2021	55
2020	30
2019	29
2018	57
2017	59
2016	49
2015	52
2014	42
2013	45
2012	57
2011	264
2010	230
2009	1
2008	1

Thrust/Theme

ESH – Environment Safety and Hea...	13
PKG – Packaging	9
NMP – Nanomanufacturing Material...	7
CD – Circuit Design	6
HWS – Hardware Security	6
LMD – Logic and Memory Devices	6
AMS-CSD – Analog/Mixed-Signal Ci...	5
PAT – Patterning	5
TT – Test & Testability	5
CADT – Computer-Aided Design and...	4
ISD – Integrated System Design	4
LPD – Logic & Physical Design	4
CBRIC-T1 – Neuro-inspired Algori...	3
NEM – Nanoengineered Materials	3
SLD – System Level Design	3
VER – Verification	3
ASCENT-T3 – Heterogeneous Integr...	2
DV – Design Verification	2
DesTech – Design Techniques	2
EP3C – Efficiency and Performanc...	2
FACSYS – Factory Systems	2
I3T – Innovative and Intelligent...	2
Modeling & Simulation	2
Physical Design	2
SCARF – Supply Chain AI Realized...	2
TechCAD – Technology CAD	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADS – Alternative Device Structu...	1
AIHW – Artificial Intelligence H...	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T2 – Beyond CMOS	1
ASCENT-T4 – Merged Logic Memory ...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CRISP-T1 – Hardware Support for ...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
ComSenTer-T1 – Systems and Algor...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
Doping Technologies	1
E2CDA2 – E2CDA 2.0	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IRP – India Research Program	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1