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- 1:
Method of Forming a Multi-Layer Semiconductor Structure Having...
- Method of Forming a Multi-Layer Semiconductor Structure Having a Seam-Less Bonding Interface Application Type: Utility Patent Number: 7064055 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p0434/
Modified: 2006-06-20 - 22KB
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- 2:
Method of Forming a Multi-Layer Semiconductor Structure Incorporating...
- Method of Forming a Multi-Layer Semiconductor Structure Incorporating a Processing Handle Member Application Type: Utility Patent Number: 7307003 Country: United States Status: ...
URL: https://www.src.org/library/patent/p0575/
Modified: 2007-12-11 - 22KB
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- 3:
Multi-Layer Semiconductor Structure Incorporating an Interference...
- Multi-Layer Semiconductor Structure Incorporating an Interference Shielding Portion Application Type: Utility Patent Number: 7067909 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0435/
Modified: 2006-06-27 - 21KB
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- 4:
TECHCON 2012 (Event E004114) - SRC
- TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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- 5:
Semiconductor Light-Emitting Structure and Graded-Composition...
- Semiconductor Light-Emitting Structure and Graded-Composition Substrate Providing Yellow-Green Light Emission Application Type: Utility Patent Number: 8063397 Country: United ...
URL: https://www.src.org/library/patent/p1020/
Modified: 2011-11-22 - 22KB
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- 6:
Optical Waveguides with Embedded Air-Gap Cladding Layer and Methods...
- Optical Waveguides with Embedded Air-Gap Cladding Layer and Methods of Fabrication Thereof Application Type: Utility Patent Number: 6807352 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0346/
Modified: 2004-10-19 - 21KB
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- 7:
Optical Waveguides Formed From Nano Air-Gap Inter-Layer Dielectric...
- Optical Waveguides Formed From Nano Air-Gap Inter-Layer Dielectric Materials and Methods of Fabrication Thereof Application Type: Utility Patent Number: 6947651 Country: United ...
URL: https://www.src.org/library/patent/p0355/
Modified: 2005-09-20 - 21KB
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- 8:
High Dielectric Constant Insulators and Associated Fabrication...
- High Dielectric Constant Insulators and Associated Fabrication Methods Application Type: Utility Patent Number: 7994590 Country: United States Status: Filed on 30-Jan-2007, Issued ...
URL: https://www.src.org/library/patent/p1003/
Modified: 2011-08-09 - 22KB
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- 9:
Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
- Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB
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- 10:
TECHCON 2011 (Event E004113) - SRC
- TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
URL: https://www.src.org/calendar/e004113/
Modified: 2012-03-13 - 97KB
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