Method of Forming a Multi-Layer Semiconductor Structure Having a Seam-Less Bonding Interface

    • Application Type:
      Utility
      Patent Number:
      7064055
      Country:
      United States
      Status:
      Filed on 5-Sep-2003, Issued on 20-Jun-2006, Patent Abandoned
      Organization:
      Massachusetts Institute of Technology
      SRC Filing ID:
      P0434

    Inventor

    • L. Rafael Reif (MIT)

    Related Patents

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    P1064
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    Method of Forming a Mulit-Layer Semiconductor Structure Having a Seam-Less Bonding Interface

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