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SRC Program

SRC	547
GRC	295
NRI	35
JUMP2	23
FCRP	17
SRCEA	10
JUMP	6
SRP	6
STARnet	5
3D EC	3
Auto	3
ERI	2
ICA	2
nCORE	2
NINE	1

Year

2024	26
2023	47
2022	55
2021	52
2020	24
2019	29
2018	50
2017	40
2016	31
2015	37
2014	49
2013	30
2012	47
2011	217
2010	196
2009	1
2008	1

Thrust/Theme

ESH – Environment Safety and Hea...	19
PKG – Packaging	10
AMS-CSD – Analog/Mixed-Signal Ci...	7
HWS – Hardware Security	7
CADT – Computer-Aided Design and...	5
LMD – Logic and Memory Devices	5
NMP – Nanomanufacturing Material...	5
SLD – System Level Design	5
CD – Circuit Design	4
ISD – Integrated System Design	4
LPD – Logic & Physical Design	4
NEM – Nanoengineered Materials	4
TT – Test & Testability	4
VER – Verification	4
ASCENT-T3 – Heterogeneous Integr...	3
I3T – Innovative and Intelligent...	3
PAT – Patterning	3
ADS – Alternative Device Structu...	2
AIHW – Artificial Intelligence H...	2
Back End Processes	2
Doping Technologies	2
FACSYS – Factory Systems	2
SCARF – Supply Chain AI Realized...	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
AMS – Analog and Mixed-Signal De...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
C&S – Controls and Sensing	1
CBRIC-T1 – Neuro-inspired Algori...	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
DesTech – Design Techniques	1
EP3C – Efficiency and Performanc...	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IMPACT-T1 – Materials for Scaled...	1
IRP – India Research Program	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & Simulation	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1
Pat(MPS) – Patterning	1
PatMat – Patterning Materials	1
PatSys – Patterning Systems	1
PhyDes – Physical Design	1
Physical Design	1