Questions?
Content Type
Events 542
Other 532
Patent Filings 60

SRC Program
SRC 614
GRC 360
NRI 41
FCRP 27
JUMP2 27
STARnet 23
JUMP 12
SRCEA 10
SRP 7
3D EC 4
Auto 4
nCORE 4
ERI 3
MSR-Intel 2
NINE 2
ICA 1
Undergrad 1

Year
2024 21
2023 48
2022 59
2021 55
2020 26
2019 32
2018 41
2017 95
2016 33
2015 43
2014 49
2013 45
2012 69
2011 250
2010 201
2009 1
2008 1

Center
IFC 34
C2S2 31
FENA 31
GSRC 31
MSD 29
MuSyC 18
SONIC 18
TxACE 17
C-FAR 13
SWAN 13
INDEX 12
LEAST 12
ACE4S 10
EBSM 10
CNFD 9
FAME 9
TerraSwarm 9
E2CDA-NRI 8
CHIRP 6
NPT 6
C-SPIN 5
CBRIC 4
CONIX 4
NRI-NSF 4
WIN 4
ASCENT 3
ComSenTer 3
MIND 3
SUPREME 3
ACE 2
CUBIC 2
ADA 1
CAPSL 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
CRISP 1
E2CDA 1
JUMP-URI 1

Thrust/Theme
SLD – System Level Design 16
CD – Circuit Design 14
PKG – Packaging 13
I3T – Innovative and Intelligent... 11
HWS – Hardware Security 8
AMS-CSD – Analog/Mixed-Signal Ci... 6
AIHW – Artificial Intelligence H... 5
ESH – Environment Safety and Hea... 5
ISD – Integrated System Design 5
LMD – Logic and Memory Devices 5
CADT – Computer-Aided Design and... 4
CONIX-T1 – ARENA Integrator 4
NMP – Nanomanufacturing Material... 4
ASCENT-T3 – Heterogeneous Integr... 3
ComSenTer-T1 – Systems and Algor... 3
LPD – Logic & Physical Design 3
TT – Test & Testability 3
VER – Verification 3
CBRIC-T1 – Neuro-inspired Algori... 2
ComSenTer-T2 – mm-wave/THz ICs a... 2
ComSenTer-T3 – Application-speci... 2
ComSenTer-T4 – Center-wide Demon... 2
IRP – India Research Program 2
NEM – Nanoengineered Materials 2
PAT – Patterning 2
SCARF – Supply Chain AI Realized... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADA-T1 – Deft Development 1
ADA-T2 – Algorithm-driven Archit... 1
ADA-T3 – Technology-driven Syste... 1
ASCENT-T1 – Vertical CMOS 1
ASCENT-T2 – Beyond CMOS 1
ASCENT-T4 – Merged Logic Memory ... 1
BEP – Back End Processes 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CBRIC-T2 – Neuromorphic Fabrics 1
CBRIC-T3 – Distributed Intellige... 1
CBRIC-T4 – Application Drivers 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CONIX-T2 – Hardware/Software Pla... 1
CONIX-T3 – Security 1
CONIX-T4 – Machine Learning 1
CONIX-T5 – Communication Positio... 1
CONIX-T6 – Programming and Resou... 1
CRISP-T1 – Hardware Support for ... 1
CRISP-T2 – System Support for Ma... 1
CRISP-T3 – Scaling Applications ... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
E2CDA2 – E2CDA 2.0 1
EP3C – Efficiency and Performanc... 1
JUMP-URI – JUMP Undergraduate Re... 1
Modeling & Simulation 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
Pat(MPS) – Patterning 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1
SUPREME-T1 – Digital and Analog 1
SUPREME-T2 – Memory and Applicat... 1
SUPREME-T3 – Interconnects and M... 1
SUPREME-T4 – Materials Discovery... 1
SemiSynBio – Semiconductor Synth... 1
URP19 – Undergrad 2019-2020 1
URP20 – Undergrad 2020-2021 1
URP21 – Undergrad 2021-2022 1
URP22 – Undergrad 2022-2023 1
URP23 – Undergrad 2023-2024 1

GRC Science Area
CADTS – Computer Aided Design & ... 62
NMS – Nanomanufacturing Sciences 53
ICSS – Integrated Circuit & Syst... 49
CSR – Cross-disciplinary Semicon... 36
DS – Device Sciences 36
IPS – Interconnect & Packaging S... 35
SRCEA – SRC Education Alliance 10
PKG – Packaging Sciences 4
ES-H – Environmental Safety & He... 3
NIS – Nanostructure & Integratio... 3
LIT – Lithography Sciences 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
PID – Process Integration & Devi... 1

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