Questions?
Content Type
Other 299
Events 183
Patent Filings 10

SRC Program
SRC 223
GRC 188
NRI 39
JUMP2 18
FCRP 10
STARnet 8
nCORE 6
3D EC 2
ERI 1
ICA 1
JUMP 1
NINE 1
SRCEA 1

Year
2024 10
2023 29
2022 34
2021 28
2020 11
2019 11
2018 15
2017 32
2016 20
2015 11
2014 14
2013 17
2012 37
2011 104
2010 105
2009 1

Center
SWAN 14
MSD 10
C2S2 9
FENA 9
GSRC 9
IFC 9
INDEX 9
C-SPIN 8
EBSM 7
MuSyC 6
MIND 5
NEWLIMITS 5
NRI-NSF 5
CHIRP 4
CNFD 4
FAME 4
LEAST 4
E2CDA-NRI 3
TxACE 3
WIN 3
Benchmarking 2
C-FAR 2
SONIC 2
TerraSwarm 2
ACE 1
AMML 1
CAPSL 1
CUBIC 1
DEEP3M 1
E2CDA 1
IMPACT 1
NPT 1
NRI-Projects 1
SMART 1
SUPREME 1

Thrust/Theme
PKG – Packaging 7
ESH – Environment Safety and Hea... 6
LMD – Logic and Memory Devices 4
NEWLIMITS-T1 – Novel Computing a... 3
NEWLIMITS-T2 – 2D Materials Devi... 3
NEWLIMITS-T4 – Characterization ... 3
Advanced Devices & Technologies 2
HWS – Hardware Security 2
NEM – Nanoengineered Materials 2
NEWLIMITS-T3 – Advanced Manufact... 2
NEWLIMITS-T5 – Simulations and M... 2
NMP – Nanomanufacturing Material... 2
AMML-T1 – Antiferromagnetic Magn... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
E2CDA2 – E2CDA 2.0 1
I3T – Innovative and Intelligent... 1
IMPACT-T1 – Materials for Scaled... 1
IMPACT-T2 – Materials for Storag... 1
PAT – Patterning 1
SMART-T1 – Spin-orbit Torque Mat... 1
SMART-T2 – Ultra-Low Loss Spin W... 1
SMART-T3 – Magneto-ionic Materia... 1

GRC Science Area
NMS – Nanomanufacturing Sciences 26
CADTS – Computer Aided Design & ... 16
ICSS – Integrated Circuit & Syst... 11
IPS – Interconnect & Packaging S... 11
CSR – Cross-disciplinary Semicon... 9
DS – Device Sciences 9
SRCEA – SRC Education Alliance 6
PKG – Packaging Sciences 4
MIC – Microstructure Sciences 2
NIS – Nanostructure & Integratio... 2
PID – Process Integration & Devi... 2

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241: pdfNeeds document - grey Area between Back-End Processing and Packaging...
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242: SemiSynBio Consortium and Roadmap - SRC
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243: pdfFISC 2030 - Session 3 - Tentzeris
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244: pdfJoint University Microelectronics Program 2.0 Proposers' Day...
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245: ARO/NSF/SRC Technical Exchange Meeting - Cell-Semiconductor Interfaces...
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246: pdfMicrosoft Word - Executive Summary-Schenkel-Nov01-10
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247: pdfSRC: Research Needs for Integrated System Design - January 2001
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248: pdfNIST's Perspective on Bioelectronics
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249: pdfNEWSLETTER
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250: New $28M Center will Develop Computers of 2025 - SRC
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251: pdf1984 Annual Report
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252: pdfIRP Advisory Board Meeting
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254: pdfSlide 1
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255: pdfEngineering Hope with Biomimetic Systems
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256: pdfDr. Malcolm Thompson - e-Workshop Packaging
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257: pdfResearch Program Annual Review
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258: pdfDUE MAY 30th Student Catalog
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259: pdfDomestic Semiconductor Industry
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Modified: 2022-04-14 - 3.1MB
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261: pdfCyber Physical Systems Looking Into the Future
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262: pdfFISC 2030 - Plenary - Curley
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264: pdfSRC/IARPA Workshop on DNA-Based Massive Information Storage ...
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265: pdfE003676 - Memory Forum - Extreme Patterning Solutions
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266: pdfProposers' Day Workshop
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267: Forum on Nanoelectronic Manufacturing: From Materials to Systems...
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268: SRC/SIA Webinar: Collaboration Towards Decadal Plan Goals: Emerging...
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269: pdfUnderlying research challenges in JUMP 2.0
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270: SRC Call for White Papers: ADT - SRC
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241 through 270 of 492 similar documents, best matches first.   
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