Content Type

Other	154
Events	107
Patent Filings	1

SRC Program

SRC	136
GRC	93
JUMP2	16
NRI	5
SRP	3
JUMP	2
STARnet	2
nCORE	2
ICA	1
SRCEA	1

Year

2024	10
2023	24
2022	16
2021	14
2020	5
2019	9
2018	7
2017	21
2016	12
2015	6
2014	4
2013	11
2012	23
2011	43
2010	51
2009	1

Center

SONIC	3
TxACE	3
ACE	2
C-FAR	2
FAME	2
LEAST	2
SUPREME	2
TerraSwarm	2
ADA	1
AMML	1
ASCENT	1
C-SPIN	1
CAPSL	1
CBRIC	1
CHIMES	1
CHIRP	1
CNFD	1
COCOSYS	1
COGNISENSE	1
CONIX	1
CRISP	1
CUBIC	1
ComSenTer	1
DEEP3M	1
E2CDA	1
IMPACT	1
INDEX	1
JUMP-URI	1
NEWLIMITS	1
PRISM	1
SMART	1
SWAN	1

Thrust/Theme

PKG – Packaging	4
AIHW – Artificial Intelligence H...	2
AMS-CSD – Analog/Mixed-Signal Ci...	2
SLD – System Level Design	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADA-T1 – Deft Development	1
ADA-T2 – Algorithm-driven Archit...	1
ADA-T3 – Technology-driven Syste...	1
AMML-T1 – Antiferromagnetic Magn...	1
ASCENT-T1 – Vertical CMOS	1
ASCENT-T2 – Beyond CMOS	1
ASCENT-T3 – Heterogeneous Integr...	1
ASCENT-T4 – Merged Logic Memory ...	1
CADT – Computer-Aided Design and...	1
CAPSL-T1 – Materials Development...	1
CAPSL-T2 – P-transistors for PSL...	1
CAPSL-T3 – Device Models and Tut...	1
CAPSL-T4 – Architectures and Sys...	1
CBRIC-T1 – Neuro-inspired Algori...	1
CBRIC-T2 – Neuromorphic Fabrics	1
CBRIC-T3 – Distributed Intellige...	1
CBRIC-T4 – Application Drivers	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CONIX-T1 – ARENA Integrator	1
CONIX-T2 – Hardware/Software Pla...	1
CONIX-T3 – Security	1
CONIX-T4 – Machine Learning	1
CONIX-T5 – Communication Positio...	1
CONIX-T6 – Programming and Resou...	1
CRISP-T1 – Hardware Support for ...	1
CRISP-T2 – System Support for Ma...	1
CRISP-T3 – Scaling Applications ...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
ComSenTer-T1 – Systems and Algor...	1
ComSenTer-T2 – mm-wave/THz ICs a...	1
ComSenTer-T3 – Application-speci...	1
ComSenTer-T4 – Center-wide Demon...	1
DEEP3M-T1 – Devices	1
DEEP3M-T2 – Circuits	1
DEEP3M-T3 – Materials	1
DEEP3M-T4 – Architectures	1
E2CDA2 – E2CDA 2.0	1
HWS – Hardware Security	1
I3T – Innovative and Intelligent...	1
IMPACT-T1 – Materials for Scaled...	1
IMPACT-T2 – Materials for Storag...	1
IRP – India Research Program	1
JUMP-URI – JUMP Undergraduate Re...	1
NEWLIMITS-T1 – Novel Computing a...	1
NEWLIMITS-T2 – 2D Materials Devi...	1
NEWLIMITS-T3 – Advanced Manufact...	1
NEWLIMITS-T4 – Characterization ...	1
NEWLIMITS-T5 – Simulations and M...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
SMART-T1 – Spin-orbit Torque Mat...	1
SMART-T2 – Ultra-Low Loss Spin W...	1
SMART-T3 – Magneto-ionic Materia...	1
SUPREME-T1 – Digital and Analog	1
SUPREME-T2 – Memory and Applicat...	1
SUPREME-T3 – Interconnects and M...	1
SUPREME-T4 – Materials Discovery...	1

GRC Science Area

CADTS – Computer Aided Design & ...	4
IPS – Interconnect & Packaging S...	4
PKG – Packaging Sciences	4
ICSS – Integrated Circuit & Syst...	3
NMS – Nanomanufacturing Sciences	2
CSR – Cross-disciplinary Semicon...	1
DS – Device Sciences	1
SRCEA – SRC Education Alliance	1