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SRC Program

SRC	480
GRC	316
NRI	37
JUMP2	26
FCRP	19
STARnet	13
SRCEA	10
JUMP	7
SRP	6
3D EC	5
Auto	3
nCORE	3
ERI	2
ICA	1

Year

2024	18
2023	46
2022	56
2021	51
2020	23
2019	24
2018	39
2017	50
2016	29
2015	31
2014	30
2013	38
2012	63
2011	231
2010	159
2009	1
2008	1

Thrust/Theme

PKG – Packaging	10
AMS-CSD – Analog/Mixed-Signal Ci...	7
ESH – Environment Safety and Hea...	7
HWS – Hardware Security	6
LMD – Logic and Memory Devices	5
I3T – Innovative and Intelligent...	4
ISD – Integrated System Design	4
NMP – Nanomanufacturing Material...	4
SLD – System Level Design	4
ASCENT-T3 – Heterogeneous Integr...	3
CADT – Computer-Aided Design and...	3
CD – Circuit Design	3
LPD – Logic & Physical Design	3
AIHW – Artificial Intelligence H...	2
CBRIC-T1 – Neuro-inspired Algori...	2
ComSenTer-T1 – Systems and Algor...	2
EP3C – Efficiency and Performanc...	2
NEM – Nanoengineered Materials	2
SCARF – Supply Chain AI Realized...	2
TT – Test & Testability	2
VER – Verification	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADA-T1 – Deft Development	1
ADA-T2 – Algorithm-driven Archit...	1
ADA-T3 – Technology-driven Syste...	1
ADS – Alternative Device Structu...	1
AMML-T1 – Antiferromagnetic Magn...	1
AMS – Analog and Mixed-Signal De...	1
ASCENT-T1 – Vertical CMOS	1
ASCENT-T2 – Beyond CMOS	1
ASCENT-T4 – Merged Logic Memory ...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CAPSL-T1 – Materials Development...	1
CAPSL-T2 – P-transistors for PSL...	1
CAPSL-T3 – Device Models and Tut...	1
CAPSL-T4 – Architectures and Sys...	1
CBRIC-T2 – Neuromorphic Fabrics	1
CBRIC-T3 – Distributed Intellige...	1
CBRIC-T4 – Application Drivers	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CONIX-T1 – ARENA Integrator	1
CONIX-T2 – Hardware/Software Pla...	1
CONIX-T3 – Security	1
CONIX-T4 – Machine Learning	1
CONIX-T5 – Communication Positio...	1
CONIX-T6 – Programming and Resou...	1
CRISP-T1 – Hardware Support for ...	1
CRISP-T2 – System Support for Ma...	1
CRISP-T3 – Scaling Applications ...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
ComSenTer-T2 – mm-wave/THz ICs a...	1
ComSenTer-T3 – Application-speci...	1
ComSenTer-T4 – Center-wide Demon...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DEEP3M-T1 – Devices	1
DEEP3M-T2 – Circuits	1
DEEP3M-T3 – Materials	1
DEEP3M-T4 – Architectures	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
DesTech – Design Techniques	1
Doping Technologies	1
E2CDA2 – E2CDA 2.0	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FACSYS – Factory Systems	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Factory Systems	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
IMPACT-T1 – Materials for Scaled...	1