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Thrust/Theme
PKG – Packaging
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- 1:
 3DASSM
- Prof. Rao R. Tummala Joseph M. Pettit Endowed Chair Professor in ECE & MSE Director, 3D Microsystems Packaging Research Center Georgia Institute of Technology - Atlanta, GA USA ...
URL: https://www.src.org/calendar/e005907/rao-tummala.pdf
Modified: 2016-06-08 - 7.4MB
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- 2:
Microsoft PowerPoint - Lall_PackagedAutomotiveSystemsR2
- cave 3 NSF Center for Advanced Vehicle and Extreme Environment Electronics Packaged Systems Research for Advanced Vehicle Electronics @CAVE3 Pradeep Lall MacFarlane Endowed ...
URL: https://www.src.org/calendar/e005907/pradeep-lall.pdf
Modified: 2016-06-08 - 10.4MB
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- 3:
PowerPoint Presentation
- Possible Needs for Automotive: Mechanically Flexible Interconnects and Advanced Cooling Muhannad Bakir 2 Interconnects in extreme condition (temperature, vibration, impact, and ...
URL: https://www.src.org/calendar/e005907/muhannad-bakir.pdf
Modified: 2016-06-08 - 2.7MB
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- 4:
Overview of Research
- Center for Power Electronics Systems The Bradley Department of Electrical and Computer Engineering College of Engineering The Center for Power Electronics Systems - High Density ...
URL: https://www.src.org/calendar/e005907/dushan-boroyevich.pdf
Modified: 2016-06-08 - 8.0MB
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- 5:
2021 Packaging CHIRP Center Review
- 2021 Packaging CHIRP Center Review August 24-26 - Virtual Event https://www.src.org/calendar/e007230/ Student Poster Information (Abstracts) Featuring: Sanoop Thekkut Ronit Das ...
URL: https://www.src.org/...ster/catalog/chirp_poster_catalog.pdf
Modified: 2021-08-23 - 597KB
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