TECHCON 2010 Best in Session Awards
Paper presentations were judged within sessions with a Best in Session Award made in each session. Representatives from member companies served as judges, using a standard set of criteria and considering both paper presentation and poster. Sessions included papers from FCRP, GRC, and NRI students with 15 GRC, 1 FCRP, and 1 NRI students winning Best in Session Awards. The following papers were judged Best in Session:
(titles were taken from the origninal abstract submission.)
Session 1 - Test and Testability | ||||
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1.6 | GRC | XiaoXiao Wang Univ. of Connecticut |
Low-Cost On-Chip Structures for Measuring NBTI Effects, Variations, Path Delay, and Noise Abstract / Presentation |
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Session 2 - Analog I/O and mm-Wave Circuit Design | ||||
2.5 | GRC | Shuqing (Victor) Cao Stanford University |
ESD and High-Speed I/O Driver Characterization and Co-Design Methodology Abstract / Presentation |
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Session 3 - Nanoengineered Materials | ||||
3.9 | GRC | Masahiro Hori niversity Waseda University |
Improving Single Dopant Detection Efficiency by Controlling Substrate Bias in Single Ion Implantation Method Abstract / Presentation |
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Session 4 - Memory and Analog Technologies | ||||
4.6 | GRC | Taehun Lee Univ. of Texas/Dallas |
High Thermal Conductivity SOI Substrates for Mixed-Signal Application Abstract / Presentation |
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Session 5 - Verification | ||||
5.5 | GRC | Bryan A. Brady Univ. of California/Berkeley |
Low-Power Verification with Term-Level Abstraction Abstract / Presentation |
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Session 6 - Multi-Core and Parallel System Design | ||||
6.7 | GRC | Karthik Ganesan Univ. of Texas/Austin |
System-level Max Power (SYMPO) - A Systematic Approach for Escalating System-Level Power Consumption using Synthetic Benchmarks Abstract / Presentation |
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Session 7 - Cu/Low k Extendability | ||||
7.7 | GRC | K.J. Ganesh Univ. of Texas/Austin |
Automated Local Texture and Stress Analysis in Cu Interconnects using D-STEM and Precession Microscopy Abstract / Presentation |
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Session 8 - Patterning Materials and Systems | ||||
8.3 | GRC | Marie Krysak Cornell University |
PAG and Base-Attached Molecular Glass Resists for Improved Lithographic Performance Abstract / Presentation |
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Session 9 - Environment, Safety, and Health | ||||
9.3 | GRC | Jeffrey Rottman Intel Foundation/SRCEA Fellow Univ. of Arizona |
Fate of CMP Nanoparticles in Municipal Wastewater Treatment Abstract / Presentation |
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Session 10 - Digital Circuits and Systems Design (10A) and 3D Design Techniques and Tools (10B) | ||||
10.6 | GRC | Tao Zhang Pennsylvania State University |
A 5-layer 3D Stacked Chip Prototyping for H.264 Application Abstract / Presentation |
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Session 11 - Packaging | ||||
11.3 | GRC | Yiwei Wang Univ. of Texas/Austin |
The Impact of Cu Pillar Bumps on the Thermomechanical Reliability and Chip-Package Interaction of Flip Chip Packages with Ultra-low k Interconnects Abstract / Presentation |
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Session 12 - Si, Ge and III-V Advanced Technologies | ||||
12.3 | GRC | Krishna Iyengar Cornell University |
Modeling Temperature and Stress Profiles in 3D during Sub-millisecond Laser Spike Annealing Abstract / Presentation |
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Session 13 - Logic/Physical Design | ||||
13.8 | FCRP | Zohaib Mahmood Mass. Institute of Technology |
System Level Modeling and Simulation of Analog Circuits Using Semidefinite Programming Based Compact Modeling Techniques Abstract / Presentation |
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Session 14 - Data Converter Design | ||||
14.9 | GRC | Jikai Chen University Univ. of Florida |
A 50mW 2.5GS/s 5-Bit ADC in 0.13um CMOS with Background Calibration for In-Situ TDR Measurements Abstract / Presentation |
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Session 15 - 3D and Beyond Cu/Low k | ||||
15.5 | GRC | Hyung Suk Yang Georgia Institute of Technology |
Marriage of CMOS and MEMS using Flexible Interconnects and TSVs Abstract / Presentation |
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Session 16 - Nano-Scale and Magnetic Devices | ||||
16.3 | NRI | Seyoung Kim Univ. of Texas/Austin |
Coulomb Drag in Independently-Contacted Graphene Bilayers Abstract / Presentation |