2022 Logic and Memory Devices Annual Review

Tuesday, October 25, 2022

Presentation Videos 

P1Jiyoung Kim / UT/Dallas

3001.001 Low Temperature HZO Ferroelectric Technology for FEOL and BEOL Applications

 

P2Wenjuan Zhu & Shaloo Rakheja / UIUC

3042.001 Solving Memory Bottleneck with Transformable Logic Devices and 3D Hybrid‐Core Systems

 

P3Uttam Singisetti & Hongping Zhao / Univ. at Buffalo

3007.001 High Speed Ultrawide Bandgap Gallium Oxide Transistors

 

P4Shengxi Huang & Swaroop Ghosh / Penn State

3011.001 Exploring Weyl Semimetals-Based Interconnect, Via, and TSV

 

P5Bilge Yildiz & Jesus A. del Alamo / MIT

3010.001 Electrochemical Artificial Synapse (EAS) Based on Ion Intercalation

 

P6Ananth Dodabalapur & Saikat Chakraborty / UT/Austin

2962.001 Thin Film Back-end Transistors for ultra-low Leakage, High-density Memory Applications

 

P9Hyunsang Hwang / POSTECH

2956.001 Materials Design for Steep Subthreshold Slope MOSFET with Single Atomic Scale Filament

 

P10Sanjay K. Banerjee & Jatin Singh / UT/Austin

3009.001 CVD TMD CMOS Process Integration

 

P11Charles Ahn / Yale

3008.001 The Development of a Monolayer Ferroelectric ZrO2

 

P12Jesus A. del Alamo / MIT

3000.001 Ferroelectric Domain Switching in the GHz Regime

 

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