Questions?
Content Type
Other 342
Events 307
Patent Filings 6

SRC Program
SRC 306
GRC 289
JUMP2 21
NRI 18
FCRP 6
3D EC 4
SRP 4
STARnet 4
Auto 3
nCORE 3
ERI 2
ICA 1
JUMP 1
NINE 1

Year
2024 13
2023 36
2022 44
2021 41
2020 14
2019 16
2018 24
2017 39
2016 20
2015 21
2014 14
2013 20
2012 55
2011 159
2010 128
2009 1

Center
TxACE 8
CHIRP 6
C2S2 5
FENA 5
GSRC 5
IFC 5
INDEX 5
MSD 5
SONIC 5
SWAN 5
LEAST 4
MIND 4
ACE4S 3
C-FAR 3
EBSM 3
FAME 3
NRI-NSF 3
TerraSwarm 3
WIN 3
ACE 2
CNFD 2
CUBIC 2
IMPACT 2
MuSyC 2
AMML 1
C-SPIN 1
CAIST 1
CAPSL 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
DEEP3M 1
E2CDA 1
E2CDA-NRI 1
IPC 1
NCRC 1
NEWLIMITS 1
NPT 1

Thrust/Theme
PKG – Packaging 11
HWS – Hardware Security 6
SLD – System Level Design 5
AMS-CSD – Analog/Mixed-Signal Ci... 4
I3T – Innovative and Intelligent... 4
ISD – Integrated System Design 4
NMP – Nanomanufacturing Material... 4
AIHW – Artificial Intelligence H... 3
CADT – Computer-Aided Design and... 3
LMD – Logic and Memory Devices 3
NEM – Nanoengineered Materials 3
CD – Circuit Design 2
EP3C – Efficiency and Performanc... 2
ESH – Environment Safety and Hea... 2
FACSYS – Factory Systems 2
IMPACT-T1 – Materials for Scaled... 2
LPD – Logic & Physical Design 2
PAT – Patterning 2
TT – Test & Testability 2
VER – Verification 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMML-T1 – Antiferromagnetic Magn... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CAPSL-T1 – Materials Development... 1
CAPSL-T2 – P-transistors for PSL... 1
CAPSL-T3 – Device Models and Tut... 1
CAPSL-T4 – Architectures and Sys... 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DEEP3M-T1 – Devices 1
DEEP3M-T2 – Circuits 1
DEEP3M-T3 – Materials 1
DEEP3M-T4 – Architectures 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
E2CDA2 – E2CDA 2.0 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IMPACT-T2 – Materials for Storag... 1
IRP – India Research Program 1
Interconnect Architecture 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T2 – 2D Materials Devi... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T4 – Characterization ... 1
NEWLIMITS-T5 – Simulations and M... 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1

GRC Science Area
CADTS – Computer Aided Design & ... 30
NMS – Nanomanufacturing Sciences 23
ICSS – Integrated Circuit & Syst... 20
IPS – Interconnect & Packaging S... 13
CSR – Cross-disciplinary Semicon... 9
DS – Device Sciences 8
SRCEA – SRC Education Alliance 8
PKG – Packaging Sciences 6
DES – Design Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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241: pdfDS_Memory_Research_Needs_2005
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242: pdfPowerPoint Presentation
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244: pdf2007 Circuit Design Need
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246: Forum on Nanoelectronic Manufacturing: From Materials to Systems...
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259: pdfOverview of Research
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263: pdfBEP Research Needs Statement
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269: University of Illinois-led SONIC Center Awarded $30 Million for...
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270: pdfBEP Research Needs Statement
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241 through 270 of 655 similar documents, best matches first.   
<< previous Page: 5 6 7 8 9 10 11 12 13 14 next >>