Questions?
Content Type
Other 226
Events 157

SRC Program
SRC 247
GRC 93
JUMP2 16
NRI 16
FCRP 4
SRCEA 3
3D EC 2
JUMP 2
SRP 2
ICA 1

Year
2024 13
2023 32
2022 28
2021 14
2020 9
2019 13
2018 13
2017 19
2016 14
2015 9
2014 16
2013 20
2012 22
2011 76
2010 84

Center
C2S2 28
FENA 28
GSRC 28
IFC 28
MSD 28
MuSyC 18
TxACE 11
EBSM 9
C-FAR 8
CNFD 8
FAME 8
INDEX 8
LEAST 8
SONIC 8
SWAN 8
TerraSwarm 8
CHIRP 7
NPT 7
ACE 1
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CUBIC 1
E2CDA-NRI 1
IPC 1
NCRC 1

Thrust/Theme
PKG – Packaging 7
NMP – Nanomanufacturing Material... 5
ESH – Environment Safety and Hea... 4
LMD – Logic and Memory Devices 3
AMS-CSD – Analog/Mixed-Signal Ci... 2
HWS – Hardware Security 2
NEM – Nanoengineered Materials 2
SCARF – Supply Chain AI Realized... 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

GRC Science Area
CADTS – Computer Aided Design & ... 41
NMS – Nanomanufacturing Sciences 41
CSR – Cross-disciplinary Semicon... 37
DS – Device Sciences 37
IPS – Interconnect & Packaging S... 30
ICSS – Integrated Circuit & Syst... 22
ES-H – Environmental Safety & He... 4
PKG – Packaging Sciences 3
SRCEA – SRC Education Alliance 3
DES – Design Sciences 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdfTECHCON Presentation Sample Slides Presenter Name followed by...
TECHCON Presentation Sample Slides Presenter Name followed by additional Authors University Presenter email address These three items required on the title slide Project ID ...
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10: pdfPowerPoint Presentation
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11: pdfPowerPoint Presentation
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12: pdfPowerPoint Presentation
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Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
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1 through 30 of 383 similar documents, best matches first.   
Results by:Thunderstone Page: 1 2 3 4 5 6 7 8 9 10 next >>