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- 1:
Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
- Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB
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- 2:
TECHCON 2012 (Event E004114) - SRC
- TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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- 3:
Devices Having Compliant Wafer-Level Input/Output Interconnections...
- Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof Application Type: Divisional Patent Number: 7468558 ...
URL: https://www.src.org/library/patent/p0654/
Modified: 2008-12-23 - 23KB
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- 4:
Devices Having Compliant Wafer-Level Input/Output Interconnections...
- Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof Application Type: Utility Patent Number: 7135777 ...
URL: https://www.src.org/library/patent/p0369/
Modified: 2006-11-14 - 23KB
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- 5:
TECHCON 2010 Best in Session Awards - SRC
- TECHCON 2010 Best in Session Awards Seventeen students received Best in Session Awards at TECHCON 2010, presented by Dr. Michael Mayberry, Intel, SRC Board of Directors Member ...
URL: https://www.src.org/calendar/e003428/best-in-session/
Modified: 2010-09-29 - 26KB
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- 6:
Probe Module for Testing Chips with Electrical and Optical Input...
- Probe Module for Testing Chips with Electrical and Optical Input/Output Interconnects, Methods of Use, and Methods of Fabrication Application Type: Utility Patent Number: 7348786 ...
URL: https://www.src.org/library/patent/p0555/
Modified: 2008-03-25 - 21KB
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