Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof
Inventors
- Kevin P. Martin (Georgia Tech)
- Muhannad S. Bakir (Georgia Tech)
- James D. Meindl (Georgia Tech)
Related Patents
Methods of interconnecting chip to module electrical, optical, and RF input\output interconnects using micro connectors and pillars
Muhannad S. Bakir (Georgia Tech); Kevin P. Martin (Georgia Tech); James D. Meindl (Georgia Tech)Patent Application Expired
Application Type: Provisional
Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof
Muhannad S. Bakir (Georgia Tech); Kevin P. Martin (Georgia Tech); James D. Meindl (Georgia Tech)Patent Abandoned
Application Type: Utility