Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof

    • Application Type:
      Utility
      Patent Number:
      7135777
      Country:
      United States
      Status:
      Filed on 5-May-2003, Issued on 14-Nov-2006, Patent Abandoned
      Organization:
      Georgia Institute of Technology
      SRC Filing ID:
      P0369

    Inventors

    • Kevin P. Martin (Georgia Tech)
    • Muhannad S. Bakir (Georgia Tech)
    • James D. Meindl (Georgia Tech)

    Related Patents

    P0368
    Application Expired
    FCRP

    Methods of interconnecting chip to module electrical, optical, and RF input\output interconnects using micro connectors and pillars

    Muhannad S. Bakir (Georgia Tech); Kevin P. Martin (Georgia Tech); James D. Meindl (Georgia Tech)
    Patent Application Expired
    Application Type: Provisional
    P0654
    Abandoned Patent
    FCRP

    Devices Having Compliant Wafer-Level Input/Output Interconnections and Packages Using Pillars and Methods of Fabrication Thereof

    Muhannad S. Bakir (Georgia Tech); Kevin P. Martin (Georgia Tech); James D. Meindl (Georgia Tech)
    Patent Abandoned
    Application Type: Divisional

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