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- 1:
Multi-Layer Semiconductor Structure Incorporating an Interference...
- Multi-Layer Semiconductor Structure Incorporating an Interference Shielding Portion Application Type: Utility Patent Number: 7067909 Country: United States Status: Filed on ...
URL: https://www.src.org/library/patent/p0435/
Modified: 2006-06-27 - 21KB
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- 2:
Method of Forming a Multi-Layer Semiconductor Structure Incorporating...
- Method of Forming a Multi-Layer Semiconductor Structure Incorporating a Processing Handle Member Application Type: Utility Patent Number: 7307003 Country: United States Status: ...
URL: https://www.src.org/library/patent/p0575/
Modified: 2007-12-11 - 22KB
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- 3:
Method of Forming a Multi-Layer Semiconductor Structure Having...
- Method of Forming a Multi-Layer Semiconductor Structure Having a Seam-Less Bonding Interface Application Type: Utility Patent Number: 7064055 Country: United States Status: Filed ...
URL: https://www.src.org/library/patent/p0434/
Modified: 2006-06-20 - 22KB
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- 4:
 PowerPoint Presentation
- RTI International High Performance Processing Systems Enabled by 3D Integration Bob Conn May 5, 2011 1 Bob Conn, RTI International, rconn@rti.org, bobconn@ieee.org RTI ...
URL: https://www.src.org/calendar/e004357/03-conn.pdf
Modified: 2011-05-04 - 1.1MB
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- 5:
Semiconductor Light-Emitting Structure and Graded-Composition...
- Semiconductor Light-Emitting Structure and Graded-Composition Substrate Providing Yellow-Green Light Emission Application Type: Utility Patent Number: 8063397 Country: United ...
URL: https://www.src.org/library/patent/p1020/
Modified: 2011-11-22 - 22KB
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- 6:
Backplane, Printed Wiring Board and\or Multi-Chip Module-Level...
- Backplane, Printed Wiring Board and\or Multi-Chip Module-Level Optical Interconnect Layer Having Embedded Air-Gap Technologies and Methods of Fabrication Application Type: ...
URL: https://www.src.org/library/patent/p0442/
Modified: 2004-09-07 - 21KB
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- 7:
3D IC University Research e-Workshop (Event E004357) - SRC
- 3D IC University Research e-Workshop Date: Thursday, May 5, 2011, noon-4:30 p.m. ET Location: SRC Conference Room D; via web conference, Research Triangle Park, NC, United States ...
URL: https://www.src.org/calendar/e004357/
Modified: 2011-11-05 - 43KB
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- 8:
Semiconductor Research Corporation - SRC
- FCRP FCRP Focus Center Research Program (Legacy) Multi-Scale Systems Research Center Creation of a comprehensive and a systematic solution to the distributed multi-scale system ...
URL: https://www.src.org/program/fcrp/
Modified: 2023-10-10 - 32KB
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- 9:
About Circuit Design - SRC
- About Circuit Design Research at C2S2 FCRP Legacy Content FCRP Phase V ended on 31-Jan-2013, and this content may no longer be current. Longer term microelectronics research is now ...
URL: https://www.src.org/program/fcrp/c2s2/about/
Modified: 2010-06-21 - 25KB
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- 10:
Presentation Title
- PAGE 1 QUALCOMM CONFIDENTIAL AND PROPRIETARY QUALCOMM CONFIDENTIAL AND PROPRIETARY qctconnect.com 3D Through Si Stacking Technology - an IFM Perspective - RikoR May 11 PAGE 2 ...
URL: https://www.src.org/calendar/e004357/02-radojcic.pdf
Modified: 2011-05-04 - 2.4MB
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