3D IC University Research e-Workshop
-
- Date:
- Thursday, May 5, 2011, noon–4:30 p.m. ET
- Location:
- SRC Conference Room D; via web conference, Research Triangle Park, NC, United States
- Type:
- e-Workshop
- Event ID:
- E004357
This e-Workshop is a web-based event featuring leaders from industry and academia who will discuss the need to extend University research efforts to address critical challenges in this rapidly emerging, disruptive technology arena.
| Thursday, May 5, 2011 | ||
|---|---|---|
| 12:00 - 12:10 PM | Jon Candelaria, SRC | |
| 12:10 - 12:50 PM | State-of-the-3D Industry, Future Opportunities and Challenges | Francoise von Trapp, 3D InCites |
| 12:50 - 1:30 PM | 3D Through Si Stacking Technology – an IFM Perspective | Riko Radjocic, Qualcomm |
| 1:30 - 2:10 PM | High Performance Processing Systems Enabled by 3D Integration | Bob Conn, RTI |
| 2:10 - 2:50 PM | 3D Test, CAD & Design Challenges and Opportunities | Robert Patti, Tezzaron |
| 2:50 - 3:05 PM | Break | |
| 3:05 - 3:45 PM | SRC-FCRP Portfolio Overview | Sung-Kyu Lim & Paul Kohl Georgia Tech |
| 3:45 - 4:25 PM | SRC-GRC Portfolio Overviewv | Madhavan Swaminathan/ Georgia Tech Yuan Xie/Penn State Paul Franzon/NC State |
| 4:25 - 4:30 PM | Wrap-up | Jon Candelaria, SRC |
| Name | Organization |
|---|---|
| Aho, Steve | Siemens EDA |
| Alapati, Ramakanth | GlobalFoundries Inc. |
| Arkalgud, Sitaram R. | SEMATECH |
| Arledge, Lawrence | Texas Instruments Incorporated |
| Augur, Rod | GlobalFoundries Inc. |
| Baek, Hyunho | University of Florida |
| Bastawros, Ashraf | Iowa State University |
| Beece, Adam | Rensselaer Polytechnic Institute |
| Beica, Rozalia G. | Applied Materials, Inc. |
| Berger, Daniel G. | IBM Corporation |
| Bonifield, Thomas D. | Texas Instruments Incorporated |
| Brofman, Peter J. | IBM Corporation |
| Celik-Butler, Zeynep | University of Texas at Arlington |
| Chan, Johnnie | Columbia University |
| Chang, Je-Young | Intel Corporation |
| Chen, Michael Y. | Siemens EDA |
| Cheng, K.T. Tim | University of California, Santa Barbara |
| Chickamenahalli, Shamala | Intel Corporation |
| Cong, Jason | University of California, Los Angeles |
| Darringer, John A. | IBM Corporation |
| Davis, W. Rhett | North Carolina State University |
| Deppisch, Carl | Intel Corporation |
| Dukovic, John O. | Applied Materials, Inc. |
| Dunne, Rajiv Carl | Texas Instruments Incorporated |
| Edwards, W. Dale | Semiconductor Research Corporation |
| Eib, Nicholas K. | GlobalFoundries Inc. |
| Eisenstadt, William R. | University of Florida |
| Elfadel, Ibrahim | Masdar University Of Science And Technology |
| Fischer, Paul | Intel Corporation |
| Franzon, Paul D. | North Carolina State University |
| Gafiteanu, Roman | Siemens EDA |
| Ghosh, Pradiptya | Siemens EDA |
| Ginsburg, Brian P. | Texas Instruments Incorporated |
| Gupta, Vikas | Texas Instruments Incorporated |
| Hartstein, Allan | IBM Corporation |
| Healy, Michael | IBM Corporation |
| Hillenius, Steven | Semiconductor Research Corporation |
| Ho, Paul S. | University of Texas at Austin |
| Hogan, Matthew | Siemens EDA |
| Ibbotson, Dale | Altera Corporation |
| Ignatowski, Michael | Advanced Micro Devices, Inc. |
| Im, Jang-Hi | University of Texas at Austin |
| Joshi, Yogendra K. | Georgia Institute of Technology |
| Keel, Min-Sun | University of Illinois at Urbana-Champaign |
| Kelly, Douglas M. | Micron Technology, Inc. |
| Kingscott, Kathleen N. | IBM Corporation |
| Kohl, Paul A. | Georgia Institute of Technology |
| Kourkoulos, Vassilis | Siemens EDA |
| Kumar, Satish | Georgia Institute of Technology |
| Kymissis, Ioannis | Columbia University |
| Lai, William | Iowa State University |
| Li, Peng | Texas A&M University - College Station |
| Li, Xin | Carnegie Mellon University |
| Lim, Sung Kyu | Georgia Institute of Technology |
| Liu, Junjun | Tokyo Electron Limited (TEL) |
| Loh, Gabriel H. | Advanced Micro Devices, Inc. |
| Long, Jon M. | Altera Corporation |
| Lu, James J.-Q. | Rensselaer Polytechnic Institute |
| Maekawa, Kaoru | Tokyo Electron Limited (TEL) |
| Mamodia, Mohit | Intel Corporation |
| Matayabas, James C. | Intel Corporation |
| Mathew, Varughese | Freescale Semiconductor, Inc. |
| Mukhopadhyay, Saibal | Georgia Institute of Technology |
| Nam, Gi-Joon | IBM Corporation |
| Nigh, Phil | IBM Corporation |
| Pan, Tony | Applied Materials, Inc. |
| Panchapakeshan, Pavan | University of Massachusetts at Amherst |
| Patel, Rakesh | GlobalFoundries Inc. |
| Patel, Sunil A. | GlobalFoundries Inc. |
| Patti, Robert | Tezzaron Semiconductor Corporation |
| Pavlidis, Vasilis | EPFL - EPF Lausanne |
| Petranovic, Dusan | Siemens EDA |
| Pierce, Mike P. | Texas Instruments Incorporated |
| Radojcic, Riko | Qualcomm |
| Rahman, Mostafizur | University of Massachusetts at Amherst |
| Rajski, Janusz | Siemens EDA |
| Rey, Juan C. | Siemens EDA |
| Rixie, Chase | University of Arizona |
| Rosenbaum, Elyse | University of Illinois at Urbana-Champaign |
| Ryan, Vivian | GlobalFoundries Inc. |
| Sapatnekar, Sachin S. | University of Minnesota |
| Schlosser, Donald W. | Novellus Systems, Inc. |
| Schumacher, Daniel L. | Siemens EDA |
| Shah, Chirag | GlobalFoundries Inc. |
| Sharma, Mahesh | Advanced Micro Devices, Inc. |
| Sinha, Snehamay | Texas Instruments Incorporated |
| Skordas, Spyridon | IBM Corporation |
| Smith, Larry N. | SEMATECH |
| Suaya, Roberto | Siemens EDA |
| Sun, Guangyu | Pennsylvania State University |
| Swaminathan, Madhavan | Pennsylvania State University |
| Tan, Chuan Seng | Nanyang Technological University |
| Valdes-Garcia, Alberto | IBM Corporation |
| Venkatraman, Vishak K. | Advanced Micro Devices, Inc. |
| Von Trapp, Francoise | 3D InCities |
| Wachtler, Kurt | Texas Instruments Incorporated |
| Webb, Clair | Intel Corporation |
| Weitzman, Elizabeth | Semiconductor Research Corporation |
| West, Jeff | Texas Instruments Incorporated |
| Wu, Boping | Intel Corporation |
| Wu, Hui | University of Rochester |
| Wu, Qi | Rensselaer Polytechnic Institute |
| Xie, Yuan | Pennsylvania State University |
| Xu, Cong | Pennsylvania State University |
| Xu, Zheng | Rensselaer Polytechnic Institute |
| Yim, Myung Jin | GlobalFoundries Inc. |
| Yu, Katie C. | Freescale Semiconductor, Inc. |
| Zhang, Tao | Pennsylvania State University |
| Zhang, Tong | Rensselaer Polytechnic Institute |
| Zimmerman, Paul A. | Intel Corporation |
Meeting Venue for Local Participants
Semiconductor Research Corporation
Conference Room D
1101 Slater Road Brighton Hall
Suite 120 (first floor, on the left)
Durham, North Carolina 27703
Phone: (919) 941-9400
Driving Directions and Parking Information
- From RDU Airport
Follow signs to I-40 West and Research Triangle Park/Durham. Travel on I-40 West to Exit 282 / Page Road. At the bottom of the exit ramp, turn right. Cross under I-40 overpass. Turn left at the first stoplight onto Emperor Boulevard. Go past the first two driveways on the right, then turn at the next right, Slater Road. (Sheraton Imperial Hotel is on left.) Brighton Hall is the fourth building on the left; the SRC is located on the first floor of Brighton Hall, Suite 120.
- From Raleigh
Travel on I-40 West to Exit 282 / Page Road. At the bottom of the exit ramp, turn right. Cross under I-40 overpass. Turn left at the first stoplight onto Emperor Boulevard. Go past the first two driveways on the right, then turn at the next right, Slater Road. (Sheraton Imperial Hotel is on left.) Brighton Hall is the fourth building on the left; the SRC is located on the first floor of Brighton Hall, Suite 120.
- From Durham and Chapel Hill
At the bottom of the exit ramp, continue straight through the traffic light onto Emperor Boulevard. Go past the first two driveways on the right, then turn at the next right, Slater Road. (Sheraton Imperial Hotel is on left.) Brighton Hall is the fourth building on the left; the SRC is located on the first floor of Brighton Hall, Suite 120. See map below.
Francoise von Trapp
Francoise von Trapp is the co-founder and editorial director of 3D InCites, an interactive online community created to stir up interest in 3D integration and 3D packaging. She is also contributing editor for Chip Scale Review magazine, an international publication for the semiconductor packaging industry. Formerly managing editor of Advanced Packaging magazine, Francoise is well-known in the advanced packaging community as an industry commentator and moderator, as well 3D Track Chair for SMTA’s International Wafer Level Packaging Conference (2010, 2011). She holds BA in Communications with a concentration in Journalism from the University of New Hampshire.
Bob Conn
Bob Conn is a Principal Engineer at RTI International. Bob has over 40 years of experience in semiconductor and systems engineering. He began his career designing integrated circuits at National Semiconductor in 1970 and was a senior engineer at Fairchild Semiconductor. For 15 years, starting in 1981, he ran his own design consulting firm, Connsult, providing design and prototype work on more than 100 projects, and receiving national recognition. Conn spent 10 years at Xilinx and was a 2-time winner of the Ross Freemen – Xilinx’s Innovator of the Year award. Conn was Chief Technology Officer and a founder of siXis – an early silicon circuit board company. He holds more than 50 patents. He has a BSEE in electrical engineering from the University of California, Berkeley. Conn has 5 gold metals in Masters World Championship Rowing. He lives on Hawaii with his wife.
Robert Patti
Bob Patti attended Rose-Hulman Institute of Technology, earning bachelor of Science degrees in both physics and electrical engineering. He founded an R&D company specializing in high-performance systems and ASICs and participated in the design of over 100 chips in the course of 12 years. Tezzaron Semiconductor grew from that company to become a leading force in 3D-IC technology, building its first working 3D-ICs in 2004. Today Bob is the CTO of Tezzaron, using wafer-level stacking processes to create ultra high-density 3D memory products and other semiconductor sub-components. He received the SEMI Award for North America in 2009, served as Vice-Chairman of JEDEC's DDRIII / Future Memories Task Group, and holds 14 US patents, numerous foreign patents, and many more pending patent applications in deep sub-micron semiconductor chip technologies.
Madhavan Swaminathan
Madhavan Swaminathan is the Joseph M. Pettit Professor in Electronics in the School of Electrical and Computer Engineering and Director of the Interconnect and Packaging Center, Georgia Tech. He is the co-founder of Jacket Micro Devices, a company that specializes in integrated RF modules and substrates for wireless applications (acquired by AVX Corporation) and the founder of E-System Design, a company focusing on the development of CAD tools for achieving signal and power integrity in integrated 3D micro and nano-systems, where he serves as the CTO. He was formerly the Deputy Director of the Microsystems Packaging Research Center at Georgia Tech. Prior to joining Georgia Tech, he was with IBM working on packaging for supercomputers. He is the author/co-author of more than 325 journal and conference publications, holds 22 patents, is the author of 3 book chapters and is the primary author of the book entitled “Power Integrity Modeling and Design for Semiconductors and Systems”, Prentice Hall, Nov 2007 and co-editor of “Introduction to System on Package”, McGraw Hill, Mar. 2008. He has been honored as an IEEE Fellow for his work on power delivery for digital and mixed signal systems and has been recognized for his work through several awards including the Technical Excellence Award from SRC in 2007. He received his M.S and PhD in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.
Paul Franzon
Paul D. Franzon is currently a Professor of Electrical and Computer Engineering at North Carolina State University. He earned his Ph.D. from the University of Adelaide, Adelaide, Australia in 1988. He has also worked at AT&T Bell Laboratories, DSTO Australia, Australia Telecom and two companies he cofounded, Communica and LightSpin Technologies. His current interests center on the technology and design of complex systems incorporating VLSI, MEMS, advanced packaging and nano-electronics. He has lead several major efforts and published over 200 papers in these areas. In 1993 he received an NSF Young Investigators Award, in 2001 was selected to join the NCSU Academy of Outstanding Teachers, in 2003, selected as a Distinguished Alumni Professor, and in 2005 won the Alcoa award. He is a Fellow of the IEEE.
