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SRC Program

SRC	307
GRC	197
NRI	78
JUMP2	22
FCRP	21
STARnet	11
nCORE	8
SRP	5
JUMP	3
SRCEA	3
3D EC	2
ICA	1

Year

2024	12
2023	32
2022	39
2021	34
2020	19
2019	15
2018	22
2017	38
2016	26
2015	19
2014	16
2013	22
2012	40
2011	146
2010	129
2009	1
2008	1

Thrust/Theme

PKG – Packaging	8
CD – Circuit Design	6
SLD – System Level Design	6
AMS-CSD – Analog/Mixed-Signal Ci...	5
ESH – Environment Safety and Hea...	5
AMML-T1 – Antiferromagnetic Magn...	4
HWS – Hardware Security	4
I3T – Innovative and Intelligent...	4
LMD – Logic and Memory Devices	4
LPD – Logic & Physical Design	4
NMP – Nanomanufacturing Material...	4
TT – Test & Testability	4
CADT – Computer-Aided Design and...	3
ISD – Integrated System Design	3
VER – Verification	3
EP3C – Efficiency and Performanc...	2
FACSYS – Factory Systems	2
Factory Systems	2
NEM – Nanoengineered Materials	2
PAT – Patterning	2
SCARF – Supply Chain AI Realized...	2
TechCAD – Technology CAD	2
ACE-T1 – Heterogeneous Computing...	1
ACE-T2 – Distributed Evolvable M...	1
ACE-T3 – Fine-grained Communicat...	1
ACE-T4 – Security Privacy and Co...	1
ACE-T5 – Demonstrators	1
ADS – Alternative Device Structu...	1
AIHW – Artificial Intelligence H...	1
AMS – Analog and Mixed-Signal De...	1
AdvTech – Advanced Technology	1
Advanced Bipolar SOI-MOS Transis...	1
Advanced Devices	1
Advanced Devices & Technologies	1
Advanced Technology Option	1
Analysis Design & Simulation	1
BEP – Back End Processes	1
Back End Processes	1
C&S – Controls and Sensing	1
CBRIC-T1 – Neuro-inspired Algori...	1
CFM&TCM – CFM & Total Chemical M...	1
CHIMES-T1 – System Driven Functi...	1
CHIMES-T2 – Monolithic 3D (M3D) ...	1
CHIMES-T3 – Ultra Dense Heteroge...	1
CHIMES-T4 – Materials Behavior S...	1
CM – Compact Modeling	1
COCOSYS-T1 – Neural Symbolic and...	1
COCOSYS-T2 – Hardware-Algorithm ...	1
COCOSYS-T3 – Technology-driven H...	1
COCOSYS-T4 – Collaborative Intel...	1
COGNISENSE-1 – Multi-spectral Ar...	1
COGNISENSE-2 – Analog-to-Insight	1
COGNISENSE-3 – Closed-Loop Atten...	1
COGNISENSE-4 – Heterogeneous Sys...	1
COGNISENSE-5 – System Software a...	1
CSR – Cross-Disciplinary Semicon...	1
CUBIC-T1 – Connectivity Networks...	1
CUBIC-T2 – Wireline and Lightwav...	1
CUBIC-T3 – Wireless Circuits and...	1
Contamination Control	1
Cost Reduction	1
DCMOS – Digital CMOS Technologie...	1
DE – Design Environment	1
DSMS – Device Sciences Modeling ...	1
DV – Design Verification	1
Defect Reduction	1
Deposition	1
DesSyn – Design Synthesis	1
DesTech – Design Techniques	1
Doping Technologies	1
E2CDA2 – E2CDA 2.0	1
Equip Automation & Process Contr...	1
Equip – Equipment	1
Equip. Auto. and Process Control	1
FAM – Factory Automation & Manag...	1
FEOL – FEOL Processes	1
FacOps – Factory Operations	1
Front End Processes	1
Heat Signal & Power Distribution	1
Heat Signal Power	1
Interconnect Architecture	1
Lithography	1
Logic Design	1
Logistics & Modeling/Simulation	1
MT – Memory Technologies	1
MTMP – Metrology Tools Matls & P...	1
Masks	1
Materials	1
Materials & Measurements	1
Metrology	1
Modeling & Simulation	1
Modeling & TCAD	1
Multi-level Interconnect	1
NCR – Non-Classical CMOS Researc...	1
NEWLIMITS-T1 – Novel Computing a...	1
NEWLIMITS-T2 – 2D Materials Devi...	1
NEWLIMITS-T3 – Advanced Manufact...	1
NEWLIMITS-T4 – Characterization ...	1
NEWLIMITS-T5 – Simulations and M...	1
PMM – Packaging Materials and Me...	1
PMS – Packaging Modeling and Sim...	1
PRISM-T1 – Systems and Software	1
PRISM-T2 – Architecture	1
PRISM-T3 – Devices and Circuits	1
PRISM-T4 – Grand Challenges	1
PS/E – Process Simplification/En...	1
Package & Electrical Design	1
Package Reliability	1
Packaging & Interconnect Systems	1
Packaging Materials Interfaces	1