Questions?
Content Type
Other 256
Events 198
Patent Filings 8

SRC Program
GRC 220
SRC 197
JUMP2 19
NRI 12
FCRP 4
3D EC 3
Auto 3
SRP 3
ICA 1
JUMP 1
NINE 1
STARnet 1
nCORE 1

Year
2024 12
2023 27
2022 24
2021 25
2020 8
2019 14
2018 17
2017 23
2016 15
2015 15
2014 10
2013 13
2012 38
2011 121
2010 88
2009 1

Center
ACE4S 9
CHIRP 5
TxACE 5
INDEX 4
SWAN 4
C-FAR 3
FAME 3
LEAST 3
SONIC 3
TerraSwarm 3
ACE 2
C2S2 2
CNFD 2
CUBIC 2
EBSM 2
FENA 2
GSRC 2
IFC 2
MIND 2
MSD 2
MuSyC 2
NRI-NSF 2
SUPREME 2
WIN 2
C-SPIN 1
CAIST 1
CDADIC 1
CEMPI 1
CHIMES 1
COCOSYS 1
COGNISENSE 1
IPC 1
NCRC 1
NPT 1
PRISM 1

Thrust/Theme
I3T – Innovative and Intelligent... 10
PKG – Packaging 9
SLD – System Level Design 9
CD – Circuit Design 5
ISD – Integrated System Design 5
HWS – Hardware Security 4
AMS-CSD – Analog/Mixed-Signal Ci... 3
AIHW – Artificial Intelligence H... 2
CADT – Computer-Aided Design and... 2
NMP – Nanomanufacturing Material... 2
ACE-T1 – Heterogeneous Computing... 1
ACE-T2 – Distributed Evolvable M... 1
ACE-T3 – Fine-grained Communicat... 1
ACE-T4 – Security Privacy and Co... 1
ACE-T5 – Demonstrators 1
ADS – Alternative Device Structu... 1
AMS – Analog and Mixed-Signal De... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
BEP – Back End Processes 1
Back End Processes 1
C&S – Controls and Sensing 1
CFM&TCM – CFM & Total Chemical M... 1
CHIMES-T1 – System Driven Functi... 1
CHIMES-T2 – Monolithic 3D (M3D) ... 1
CHIMES-T3 – Ultra Dense Heteroge... 1
CHIMES-T4 – Materials Behavior S... 1
CM – Compact Modeling 1
COCOSYS-T1 – Neural Symbolic and... 1
COCOSYS-T2 – Hardware-Algorithm ... 1
COCOSYS-T3 – Technology-driven H... 1
COCOSYS-T4 – Collaborative Intel... 1
COGNISENSE-1 – Multi-spectral Ar... 1
COGNISENSE-2 – Analog-to-Insight 1
COGNISENSE-3 – Closed-Loop Atten... 1
COGNISENSE-4 – Heterogeneous Sys... 1
COGNISENSE-5 – System Software a... 1
CSR – Cross-Disciplinary Semicon... 1
CUBIC-T1 – Connectivity Networks... 1
CUBIC-T2 – Wireline and Lightwav... 1
CUBIC-T3 – Wireless Circuits and... 1
Contamination Control 1
Cost Reduction 1
DCMOS – Digital CMOS Technologie... 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
IRP – India Research Program 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Lithography 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
PAT – Patterning 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PRISM-T1 – Systems and Software 1
PRISM-T2 – Architecture 1
PRISM-T3 – Devices and Circuits 1
PRISM-T4 – Grand Challenges 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1

GRC Science Area
ICSS – Integrated Circuit & Syst... 20
CADTS – Computer Aided Design & ... 15
IPS – Interconnect & Packaging S... 11
NMS – Nanomanufacturing Sciences 8
SRCEA – SRC Education Alliance 6
CSR – Cross-disciplinary Semicon... 5
DS – Device Sciences 5
PKG – Packaging Sciences 5
DES – Design Sciences 1
ES-H – Environmental Safety & He... 1
FAC – Factory Sciences 1
GEN – General 1
INT – Interconnect Sciences 1
ISA – Industrial Support Activit... 1
LIT – Lithography Sciences 1
MBP – Materials & Bulk Processes... 1
MFG – Manufacturing Sciences 1
MFGPS – Manufacturing Process Sc... 1
MIC – Microstructure Sciences 1
MPS – Material & Process Science... 1
MSS – Manufacturing Systems Scie... 1
NIS – Nanostructure & Integratio... 1
PID – Process Integration & Devi... 1
SMS – Semiconductor Modeling & S... 1
TT – Technology Transfer 1

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1: pdfFISC 2030 - Session 3 - Amerasekera
Forum on Integrated Sensors for Cybersystems Making Sensors Happen Ajith Amerasekera Texas Instruments Inc. Dallas, USA 22 March 2012 Challenges and Needs .The promise is obvious - ...
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