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SRC Program
GRC 553
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JUMP 48
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IFC 72
C-SPIN 40
TxACE 33
C2S2 32
FENA 29
GSRC 25
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LEAST 20
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MSD 16
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CRISP 11
SONIC 9
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WIN 7
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INDEX 3
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CD – Circuit Design 59
PAT – Patterning 43
TT – Test & Testability 35
Advanced Devices & Technologies 26
SLD – System Level Design 23
AMS-CSD – Analog/Mixed-Signal Ci... 22
I3T – Innovative and Intelligent... 22
HWS – Hardware Security 21
ISD – Integrated System Design 21
LPD – Logic & Physical Design 19
CADT – Computer-Aided Design and... 17
Factory Systems 17
NMP – Nanomanufacturing Material... 15
Pat(MPS) – Patterning 15
PKG – Packaging 14
BEP – Back End Processes 13
NEM – Nanoengineered Materials 13
ASCENT-T1 – Vertical CMOS 12
CRISP-T1 – Hardware Support for ... 9
ADS – Alternative Device Structu... 8
ASCENT-T2 – Beyond CMOS 8
DCMOS – Digital CMOS Technologie... 8
Back End Processes 7
AMML-T1 – Antiferromagnetic Magn... 6
DesTech – Design Techniques 6
Doping Technologies 6
MT – Memory Technologies 6
PatMat – Patterning Materials 6
CFM&TCM – CFM & Total Chemical M... 5
CONIX-T1 – ARENA Integrator 5
VER – Verification 5
CBRIC-T2 – Neuromorphic Fabrics 4
ESH – Environment Safety and Hea... 4
IMPACT-T1 – Materials for Scaled... 4
Packaging & Interconnect Systems 4
Physical Design 4
TechCAD – Technology CAD 4
ADA-T1 – Deft Development 3
AIHW – Artificial Intelligence H... 3
DEEP3M-T4 – Architectures 3
Lithography 3
MTMP – Metrology Tools Matls & P... 3
Masks 3
Materials 3
Modeling & Simulation 3
SemiSynBio – Semiconductor Synth... 3
CBRIC-T1 – Neuro-inspired Algori... 2
CRISP-T3 – Scaling Applications ... 2
ComSenTer-T1 – Systems and Algor... 2
DesSyn – Design Synthesis 2
LMD – Logic and Memory Devices 2
Multi-level Interconnect 2
NEWLIMITS-T2 – 2D Materials Devi... 2
Processes – Processes 2
AMS – Analog and Mixed-Signal De... 1
ASCENT-T4 – Merged Logic Memory ... 1
AdvTech – Advanced Technology 1
C&S – Controls and Sensing 1
CAPSL-T4 – Architectures and Sys... 1
CM – Compact Modeling 1
ComSenTer-T2 – mm-wave/THz ICs a... 1
ComSenTer-T3 – Application-speci... 1
DEEP3M-T2 – Circuits 1
DV – Design Verification 1
Deposition 1
E2CDA2 – E2CDA 2.0 1
Front End Processes 1
IMPACT-T2 – Materials for Storag... 1
Metrology 1
NEWLIMITS-T1 – Novel Computing a... 1
NEWLIMITS-T3 – Advanced Manufact... 1
NEWLIMITS-T4 – Characterization ... 1
Reliability 1
SMART-T1 – Spin-orbit Torque Mat... 1
Synthesis & Verification 1
GRC Science Area
MPS – Material & Process Science... 119
NIS – Nanostructure & Integratio... 100
ICSS – Integrated Circuit & Syst... 92
CADTS – Computer Aided Design & ... 82
NMS – Nanomanufacturing Sciences 82
LIT – Lithography Sciences 41
DS – Device Sciences 33
IPS – Interconnect & Packaging S... 32
MIC – Microstructure Sciences 32
DES – Design Sciences 30
PID – Process Integration & Devi... 28
MBP – Materials & Bulk Processes... 23
INT – Interconnect Sciences 11
MFGPS – Manufacturing Process Sc... 4
ES-H – Environmental Safety & He... 3
FAC – Factory Sciences 1
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11: Signal Tracing Using On-Chip Memory For In-System Post-Fabrication...
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15: Integrated Circuit With Topological Semimetal Interconnect (Patent...
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16: Switched-Capacitor Circuit (Patent P1028) - SRC
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URL: https://www.src.org/library/patent/p0074/
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URL: https://www.src.org/library/patent/p1490/
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19: Mixed-signal Substrate with Integrated Through-Substrate Vias...
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Built-in Current Testing of Integrated Circuits Application Type: Utility Patent Number: 5025344 Country: United States Status: Filed on 22-Feb-1990, Issued on 18-Jun-1991, Patent ...
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