Mixed-signal Substrate with Integrated Through-Substrate Vias

    • Application Type:
      Utility
      Patent Number:
      10330874
      Country:
      United States
      Status:
      Filed on 2-Feb-2017, Issued on 25-Jun-2019
      Organization:
      Georgia Institute of Technology
      SRC Filing ID:
      P1675

    Inventors

    • Muhannad S. Bakir (Georgia Tech)
    • Paragkumar A. Thadesar (Georgia Tech)

    Related Patents

    P1604
    Application Expired
    GRC

    Mixed-signal Substrate with Integrated Through-substrate Vias and Deep-trench Decoupling Capacitors

    Muhannad S. Bakir (Georgia Tech); Paragkumar A. Thadesar (Georgia Tech)
    Patent Application Expired
    Application Type: Provisional

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