Method and Architecture for Pre-bond Probing of TSVs in 3D Stacked Integrated Circuits

• Application Type:

  Utility

  Patent Number:

  8775108

  Country:

  United States

  Status:

  Filed on 29-Jun-2011, Issued on 8-Jul-2014

  Organization:

  Duke University

  SRC Filing ID:

  P1291

Inventors

• Krishnendu Chakrabarty (Duke)
• Brandon Noia (Duke)