Questions?
[x] GRC Science Area
DS – Device Sciences

Content Type
Events 15
Patent Filings 6
Other 1

SRC Program
SRC 15
GRC 7

Year
2013 4
2012 2
2011 3
2010 6

Center
C2S2 10
FENA 10
GSRC 10
IFC 10
MSD 10
C-FAR 5
CNFD 5
FAME 5
INDEX 5
LEAST 5
SONIC 5
SWAN 5
TerraSwarm 5
MuSyC 4
EBSM 3
TxACE 3
NPT 2
ACE4S 1
CAIST 1
CDADIC 1
CEMPI 1
CHIRP 1
IPC 1
NCRC 1

Thrust/Theme
Lithography 3
BEP – Back End Processes 2
DCMOS – Digital CMOS Technologie... 2
Materials 2
ADS – Alternative Device Structu... 1
AIHW – Artificial Intelligence H... 1
AMS – Analog and Mixed-Signal De... 1
AMS-CSD – Analog/Mixed-Signal Ci... 1
AdvTech – Advanced Technology 1
Advanced Bipolar SOI-MOS Transis... 1
Advanced Devices 1
Advanced Devices & Technologies 1
Advanced Technology Option 1
Analysis Design & Simulation 1
Back End Processes 1
C&S – Controls and Sensing 1
CADT – Computer-Aided Design and... 1
CD – Circuit Design 1
CFM&TCM – CFM & Total Chemical M... 1
CM – Compact Modeling 1
CSR – Cross-Disciplinary Semicon... 1
Contamination Control 1
Cost Reduction 1
DE – Design Environment 1
DSMS – Device Sciences Modeling ... 1
DV – Design Verification 1
Defect Reduction 1
Deposition 1
DesSyn – Design Synthesis 1
DesTech – Design Techniques 1
Doping Technologies 1
EP3C – Efficiency and Performanc... 1
ESH – Environment Safety and Hea... 1
Equip Automation & Process Contr... 1
Equip – Equipment 1
Equip. Auto. and Process Control 1
FACSYS – Factory Systems 1
FAM – Factory Automation & Manag... 1
FEOL – FEOL Processes 1
FacOps – Factory Operations 1
Factory Systems 1
Front End Processes 1
HWS – Hardware Security 1
Heat Signal & Power Distribution 1
Heat Signal Power 1
I3T – Innovative and Intelligent... 1
ISD – Integrated System Design 1
Interconnect Architecture 1
LMD – Logic and Memory Devices 1
LPD – Logic & Physical Design 1
Logic Design 1
Logistics & Modeling/Simulation 1
MT – Memory Technologies 1
MTMP – Metrology Tools Matls & P... 1
Masks 1
Materials & Measurements 1
Metrology 1
Modeling & Simulation 1
Modeling & TCAD 1
Multi-level Interconnect 1
NCR – Non-Classical CMOS Researc... 1
NEM – Nanoengineered Materials 1
NMP – Nanomanufacturing Material... 1
PAT – Patterning 1
PKG – Packaging 1
PMM – Packaging Materials and Me... 1
PMS – Packaging Modeling and Sim... 1
PS/E – Process Simplification/En... 1
Package & Electrical Design 1
Package Reliability 1
Packaging & Interconnect Systems 1
Packaging Materials Interfaces 1
Pat(MPS) – Patterning 1
PatMat – Patterning Materials 1
PatSys – Patterning Systems 1
PhyDes – Physical Design 1
Physical Design 1
Plasma Etch 1
Process Architecture 1
Processes – Processes 1
Quality & Reliability 1
Rapid Yield Learning 1
Reliability 1
Resist 1
SLD – System Level Design 1
SemiSynBio – Semiconductor Synth... 1
Semiconductor Modeling & Simulat... 1
Signal/Power Management 1
Substrates 1
Synthesis & Verification 1
TCAD-MBPS 1
TM – Thermal Management 1
TT – Test & Testability 1
TechCAD – Technology CAD 1
VER – Verification 1

1 through 22 of 22 similar documents, best matches first.   
1: TECHCON 2012 (Event E004114) - SRC
TECHCON 2012 Date: Monday, Sept. 10, 2012, 8 a.m. - Tuesday, Sept. 11, 2012, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004114 E004114 ...
URL: https://www.src.org/calendar/e004114/
Modified: 2013-03-11 - 98KB
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2: TECHCON 2011 (Event E004113) - SRC
TECHCON 2011 Date: Monday, Sept. 12, 2011, 8 a.m. - Tuesday, Sept. 13, 2011, 10 p.m. CT Location: Renaissance Austin Hotel, Austin, TX, United States Event ID: E004113 E004113 ...
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Modified: 2012-03-13 - 97KB
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3: TECHCON 2013 (Event E004683) - SRC
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4: Semiconductor Research Corporation - SRC
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5: 2010 Inventor Recognition Award Winners - SRC
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6: Electrical Device Including Dielectric Layer Formed By Direct...
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8: pdfDescription
Call for Abstracts Call for abstracts opens Monday, January 16, 2012. Deadline for submission is 3:00 p.m. eastern time on Wednesday, February 22, 2012. Description TECHCON is ...
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9: Growth of Inorganic Thin Films using Self-Assembled Monolayers...
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Modified: 2010-11-09 - 22KB
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10: Selective Deposition of Tungsten on TISI2 (Patent P0149) - SRC
Selective Deposition of Tungsten on TISI2 Application Type: Utility Patent Number: 5138432 Country: United States Status: Filed on 11-Mar-1991, Issued on 11-Aug-1992, Patent ...
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Modified: 1992-08-11 - 21KB
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11: Photoresists Containing Water Soluble Sugar Crosslinking Agents...
Photoresists Containing Water Soluble Sugar Crosslinking Agents Application Type: Utility Patent Number: 5536616 Country: United States Status: Filed on 21-Sep-1994, Issued on ...
URL: https://www.src.org/library/patent/p0018/
Modified: 1996-07-16 - 21KB
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TECHCON 2010 is a not-to-be-missed event for faculty. Here's why: Faculty who have a student presenting also have an exceptional opportunity to discuss their research with industry ...
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URL: https://www.src.org/calendar/e004683/uro/
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21: 2013 GRC SACC and TAB Chair Recognition - SRC
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22: pdfMicrosoft PowerPoint - Watson SRC TECHCON 090913 FINAL PUBLISH...
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1 through 22 of 22 similar documents, best matches first.