Method of Providing Stress-Free Thermally-Conducting Attachment of Two Bodies

    • Application Type:
      Utility
      Patent Number:
      5051814
      Country:
      United States
      Status:
      Filed on 25-Jan-1989, Issued on 24-Sep-1991, Patent Expired
      Organization:
      Stanford University
      SRC Filing ID:
      P0157

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