Compliant Wafer-Level Packaging Devices and Methods of Fabrication

• Application Type:

  Utility

  Patent Number:

  6690081

  Country:

  United States

  Status:

  Filed on 19-Nov-2001, Issued on 10-Feb-2004, Patent Abandoned

  Organization:

  Georgia Institute of Technology

  SRC Filing ID:

  P0349

Inventors

• Paul A. Kohl (Georgia Tech)
• Muhannad S. Bakir (Georgia Tech)
• Hollie A. Reed (Georgia Tech)
• Chirag S. Patel (Georgia Tech)
• Kevin P. Martin (Georgia Tech)
• James D. Meindl (Georgia Tech)